公开(公告)号：US20200283619A1

公开(公告)日：2020-09-10

申请号：US16756518

申请日：2018-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brett A. Beiermann ,  John C. Clark ,  Eric G. Larson ,  Jeremy M. Higgins ,  Audrey S. Forticaux ,  Jay R. Lomeda ,  Wayne S. Mahoney ,  Scott B. Charles ,  Timothy D. Fletcher ,  Wendy L. Thompson ,  Kyle R. Schwartz

IPC: C08L63/00 ,  H05K5/02 ,  C08K3/22 ,  C08K7/20 ,  C08K3/14 ,  C08K3/38

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

公开(公告)号：US11773254B2

公开(公告)日：2023-10-03

申请号：US16756518

申请日：2018-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brett A. Beiermann ,  John C. Clark ,  Eric G. Larson ,  Jeremy M. Higgins ,  Audrey S. Forticaux ,  Jay R. Lomeda ,  Wayne S. Mahoney ,  Scott B. Charles ,  Timothy D. Fletcher ,  Wendy L. Thompson ,  Kyle R. Schwartz

IPC: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02

CPC classification number: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/009

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

公开(公告)号：US20230383114A1

公开(公告)日：2023-11-30

申请号：US18366753

申请日：2023-08-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brett A. Beiermann ,  John C. Clark ,  Eric G. Larson ,  Jeremy M. Higgins ,  Audrey S. Forticaux ,  Jay R. Lomeda ,  Wayne S. Mahoney ,  Scott B. Charles ,  Timothy D. Fletcher ,  Wendy L. Thompson ,  Kyle R. Schwartz

IPC: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02

CPC classification number: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/009

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.