METHOD OF CONTACT COATING A MICRONEEDLE ARRAY
    4.
    发明申请
    METHOD OF CONTACT COATING A MICRONEEDLE ARRAY 有权
    接触涂层麦克风阵列的方法

    公开(公告)号:US20130216694A1

    公开(公告)日:2013-08-22

    申请号:US13851149

    申请日:2013-03-27

    Abstract: A method of coating a microneedle array by applying a coating fluid using a flexible film in a brush-like manner. A method of coating a microneedle array comprising: providing a microneedle array having a substrate and a plurality of microneedles; providing a flexible film; providing a coating solution comprising a carrier fluid and a coating material; applying the coating solution onto a first major surface of the flexible film; performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles; and allowing the carrier fluid to evaporate.

    Abstract translation: 通过以类似刷子的方式使用柔性膜施加涂布液来涂布微针阵列的方法。 一种涂覆微针阵列的方法,包括:提供具有基底和多个微针的微针阵列; 提供柔性膜; 提供包含载体流体和涂层材料的涂层溶液; 将涂布溶液施加到柔性膜的第一主表面上; 执行将柔性膜的第一主表面与微针接触并移除柔性膜以与微针接触的转印步骤; 并允许载体液体蒸发。

Patent Agency Ranking