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公开(公告)号:WO2002094912A1
公开(公告)日:2002-11-28
申请号:PCT/US2002/007951
申请日:2002-03-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: JING, Naiyong , PHAM, Trang, D. , HINE, Andrew, M.
IPC: C08J5/12
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/31536 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31678 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.
Abstract translation: 多层结构包括结合到基底上的氟聚合物。 通过将结合组合物暴露于光化辐射如紫外线辐射来形成结构来制备结构。 粘合组合物包括光吸收化合物和电子给体。 粘合组合物包括非粘合材料。
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公开(公告)号:WO2002094911A2
公开(公告)日:2002-11-28
申请号:PCT/US2002/005799
申请日:2002-02-25
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: JING, Naiyong , HINE, Andrew, M. , SCHULZ, William, J. , PHAM, Trang, D. , HAAK, Christopher, A.
IPC: C08J5/12
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by heating a bonding composition to form the bond. The bonding composition includes an amino-substituted organosilane. The bonding composition includes non-adhesive materials.
Abstract translation: 多层结构包括结合到基底上的氟聚合物。 通过加热粘合组合物以形成结合物来制备结构。 粘合组合物包括氨基取代的有机硅烷。 粘合组合物包括非粘合材料。
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公开(公告)号:EP1401927A2
公开(公告)日:2004-03-31
申请号:EP02725015.8
申请日:2002-02-25
Applicant: 3M Innovative Properties Company
Inventor: JING, Naiyong , HINE, Andrew, M. , SCHULZ, William, J. , PHAM, Trang, D. , HAAK, Christopher, A.
IPC: C08J5/12
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by heating a bonding composition to form the bond. The bonding composition includes an amino-substituted organosilane. The bonding composition includes non-adhesive materials.
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公开(公告)号:EP1401927B1
公开(公告)日:2006-05-03
申请号:EP02725015.8
申请日:2002-02-25
Applicant: 3M Innovative Properties Company
Inventor: JING, Naiyong , HINE, Andrew, M. , SCHULZ, William, J. , PHAM, Trang, D. , HAAK, Christopher, A.
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by heating a bonding composition to form the bond. The bonding composition includes an amino-substituted organosilane. The bonding composition includes non-adhesive materials.
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5.
公开(公告)号:EP1401926B1
公开(公告)日:2006-08-09
申请号:EP02719247.5
申请日:2002-03-13
Applicant: 3M Innovative Properties Company
Inventor: JING, Naiyong , PHAM, Trang, D. , HINE, Andrew, M.
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/31536 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31678 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.
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公开(公告)号:EP1401926A1
公开(公告)日:2004-03-31
申请号:EP02719247.5
申请日:2002-03-13
Applicant: 3M Innovative Properties Company
Inventor: JING, Naiyong , PHAM, Trang, D. , HINE, Andrew, M.
IPC: C08J5/12
CPC classification number: C08J5/124 , C08J2327/12 , Y10T428/31536 , Y10T428/3154 , Y10T428/31544 , Y10T428/31649 , Y10T428/31678 , Y10T428/31699
Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.
Abstract translation: 多层结构包括与基材结合的含氟聚合物。 该结构通过将粘合组合物暴露于光化辐射例如紫外辐射来形成粘合来制备。 粘合组合物包含吸光化合物和电子给体。 粘合组合物包括非粘合材料。
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