Orthodontic composition with polymeric fillers
    3.
    发明授权
    Orthodontic composition with polymeric fillers 有权
    正畸组合物与聚合物填料

    公开(公告)号:US09351908B2

    公开(公告)日:2016-05-31

    申请号:US14466626

    申请日:2014-08-22

    Abstract: Orthodontic adhesives are claimed which use polymeric filler particles with defined particle size characteristics. The particle size characteristics are controlled such that these adhesives provide comparable mechanical retention and cohesive strength of conventional orthodontic adhesives when used to bond orthodontic appliances to teeth. Because polymeric fillers are generally softer than inorganic fillers, these adhesives are easier to remove from the tooth than conventional adhesives after debonding an orthodontic appliance. Embodiments of the invention include both self-curing and two-part adhesives, packaged adhesive-coated orthodontic appliances, and methods for removing a cured adhesive from a tooth surface.

    Abstract translation: 要求使用具有确定的粒度特性的聚合物填料颗粒的正畸粘合剂。 控制粒度特征,使得这些粘合剂当用于将正畸器具粘合到牙齿上时,提供了常规正畸粘合剂相当的机械保持性和内聚强度。 因为聚合物填料通常比无机填料柔软,因此在脱粘矫正器具之后,这些粘合剂比常规粘合剂更容易从牙齿上除去。 本发明的实施例包括自固化和两部分粘合剂,包装的粘合剂涂覆的正畸矫治器,以及从牙齿表面去除固化的粘合剂的方法。

    Curable Precursor of an Adhesive Composition

    公开(公告)号:US20250059328A1

    公开(公告)日:2025-02-20

    申请号:US18718503

    申请日:2022-12-07

    Abstract: The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprising a cured adhesive, wherein the cured adhesive is the reaction product of said curable precursor, and to a process for making said curable precursor of an adhesive composition, the process comprising reacting an amine-terminated polyamide with a bis-maleimide by a poly-Michael-Addition.

    Silicone elastomers by free radical mediated cure

    公开(公告)号:US12234389B2

    公开(公告)日:2025-02-25

    申请号:US17764744

    申请日:2020-09-25

    Abstract: Curable compositions of this disclosure comprise a mixture of: a silanol, a free radical initiator, an iodonium salt; and optionally an alkoxysilane, and/or an MQ resin, and/or (meth)acrylate monomer(s). In another aspect, cured compositions of this disclosure comprise: a cured silicone, a free radical initiator or residue thereof, an iodonium salt or residue thereof; and optionally a poly(meth)acrylate and/or an MQ resin, which may comprise the cured silicone. In another aspect, cured compositions of this disclosure comprise: a continuous phase of cured silicone, a discontinuous phase of poly(meth)acrylate inclusions, and optionally an MQ resin, which may comprise the cured silicone. The poly(meth)acrylate inclusions may have an average diameter of less than 1.0 micrometer or smaller. The compositions may be pressure sensitive adhesives. The curable and cured compositions may be solvent-free.

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