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公开(公告)号:US20190055434A1
公开(公告)日:2019-02-21
申请号:US16077881
申请日:2017-04-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Joon Chatterjee , Jenny B. Werness , Stefan H. Gryska , Babu N. Gaddam , Surojit Sinha , Raja Krishnamurthy
Abstract: An adhesive copolymer comprising acrylate ester monomer units, poly(phenyleneoxide)-functional (meth)acryloyl monomer units, optional acid-functional monomer units, and optional non-acid functional polar monomer units is described.
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公开(公告)号:US20180072928A1
公开(公告)日:2018-03-15
申请号:US15565265
申请日:2016-05-02
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Joon Chatterjee , Raja Krishnamurthy , Surojit Sinha , Babu N. Gaddam
IPC: C09J133/08 , C08L33/08 , C09J7/02
CPC classification number: C09J133/08 , C08F220/18 , C08L25/08 , C08L33/08 , C09J7/385 , C09J2425/00 , C09J2433/00 , C08F2220/1825 , C08F220/34 , C08F220/20
Abstract: An adhesive composition is described comprising a tertiary amine- and hydroxyl-functional (meth)acrylate copolymer and a styrene/maleic anhydride crosslinking agent, which when crosslinked, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
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公开(公告)号:US20170275505A1
公开(公告)日:2017-09-28
申请号:US15529629
申请日:2015-12-04
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Surojit Sinha , Raja Krishnamurthy , Joon Chatterjee
IPC: C09J7/02 , C08F297/04 , C09J153/02
CPC classification number: C08L9/00 , C08F297/044 , C09J7/387 , C09J153/02 , C09J2409/00 , C09J2453/00
Abstract: Pressure sensitive adhesives made from a polymodal asymmetric elastomeric block copolymer, a tackifying resin and liquid polyisoprene are provided. Articles containing these pressure sensitive adhesives including protective sheeting, labels, laminated adhesives, tapes and adhesive films are described. The pressure sensitive adhesive based on polymodal asymmetric block copolymer described herein exhibits good adhesion on various substrates such as stainless steel (SS), polypropylene (PP) and high density polyethylene (HDPE) and enhanced high temperature shear without the effect of electron beam or UV curing.
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