公开(公告)号：JPH07164196A

公开(公告)日：1995-06-27

申请号：JP15129694

申请日：1994-07-01

Applicant: ABB RESEARCH LTD

Inventor： RAINHARUTO FURIITO

IPC: B30B11/00 ,  B22F3/10 ,  B22F3/12 ,  B22F3/22 ,  B28B3/02 ,  B30B11/02 ,  C04B35/00 ,  C04B35/101 ,  C04B35/14 ,  C04B35/622 ,  C04B35/64 ,  F27D5/00

Abstract: PURPOSE: To produce a setter which surely supports an unwrought article to be carried during a sintering stage by imparting a behavior to adapt itself to the shrinkage behaviors of the unwrought article to be sintered and to shrink at the same degree as the shrinkage degree of the unwrought article to the unwrought article. CONSTITUTION: This process is for production of the setter which surely supports the unwrought article carried therein during the sintering stage. This setter is produced from powder material containing a binder by the ensuing stages. a) The powder material is packed into a green mold; b) the powder material is press molded in the closed green mold to form a green compact; c) the press molded green compact is taken out of the green mold; d) the green compact is presintered to form an unfinished item and 1) this unfinished item is subjected to machining to form finished goods. Since the unwrought article to be sintered consists of the material having the different shrinkage behaviors, the production parameters of this time are changed to be individually adapted to the respective unwrought articles to be sintered. As a result, the free use of the setters having a wide range of co-shrinkability adaptable to the respective fields of use is made possible and the setter for surely supporting the unwrought article is produced.

公开(公告)号：JPH09306711A

公开(公告)日：1997-11-28

申请号：JP29635596

申请日：1996-11-08

Applicant: ABB RESEARCH LTD

Inventor： TOUUDORU BAIATOU ,  PEETAA ETSUTAA ,  RAINHARUTO FURIITO ,  HANSUUYURUKU BUIISUMAN

IPC: H01C13/02 ,  H01C1/08 ,  H01C7/02 ,  H01C7/12 ,  H02H9/02 ,  H02M9/02

Abstract: PROBLEM TO BE SOLVED: To provide a current limiter in which almost equal partial currents flow through two operating resistors connected in parallel at a branch point, low-inductance resistor paths are overlapped in the same region of the resistors, and the partial currents flow in opposite directions, thereby reducing inductance. SOLUTION: PTC resistors 21, 22 are electrically insulated and has a slight space therebetween. The PTC resistors 21, 22 are constructed by metal braid, metallographic structure, or porous metal babbles and are kept at a proper operating temperature by blast air cooling. The meanders or resistor paths 21a to 21c and 22a to 22c of the PTC resistors 21, 22 are connected by electric contact bridges 23, 23' and 24, 24'. The sum current is divided into partial currents 11, 12 which are equal and flow in the opposite directions through the meanders 21a to 21c and 22a to 22c which are folded in the vertical direction. As a result, the PTC resistors 21, 22 have small inductance.

公开(公告)号：JPH09176818A

公开(公告)日：1997-07-08

申请号：JP33444496

申请日：1996-12-02

Applicant: ABB RESEARCH LTD

Inventor： RAINHARUTO FURIITO

IPC: C23C24/10 ,  C23C4/02 ,  C23C4/18 ,  C23C24/08 ,  C23C26/00 ,  C23C28/00

Abstract: A method of applying a metallic bonding layer for thermally sprayed ceramic heat insulating layers (6) on metallic components involves (a) applying a binder onto the degreased and oxide-free metallic surface of the substrate material (2); (b) applying metallic bonding powder (4) uniformly onto the binder; (c) applying solder powder (5), of smaller particle size than the bonding powder (4), uniformly onto the binder; and (d) drying the binder and heat treating to effect soldering. In an alternative method, an oxidation and corrosion resistant layer is produced on the cleaned metallic surface by gas-shielded plasma spraying prior to step (a), the bonding powder is a coarse powder having the same composition as this oxidation and corrosion resistant layer, step (c) is omitted and step (d) comprises drying the binder and then heat treating (solution annealing) to form a sintered bond between the metallic component and the oxidation and corrosion resistant layer and between the oxidation and corrosion resistant layer and the bonding powder. Also claimed are metallic bonding layers produced by the above methods.