公开(公告)号：US20250157701A1

公开(公告)日：2025-05-15

申请号：US18946822

申请日：2024-11-13

Applicant: ABB Schweiz AG

Inventor： Adrian Hozoi ,  Felix Sommer ,  Vadim Migunov ,  Marek Pavlas

IPC: H01C1/028 ,  H01C3/18 ,  H01C13/02

Abstract: A resistor structure includes at least an electrically insulating substrate, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path comprising at least one resistive trace directly or indirectly provided on the substrate and directly or indirectly joined to the terminal, wherein a thickness of the resistive trace is the thickness of the resistive trace in the thickness direction facing away from the substrate, characterized in that at least one insulator element is applied directly or indirectly and at least partially on the substrate, wherein a thickness of the insulator element is the thickness of the insulator element in the thickness direction facing away from the substrate.

公开(公告)号：US20250157704A1

公开(公告)日：2025-05-15

申请号：US18947199

申请日：2024-11-14

Applicant: ABB Schweiz AG

Inventor： Adrian Hozoi ,  Felix Sommer ,  Vadim Migunov ,  Jaromir Podzemny

IPC: H01C7/18 ,  H01C1/14

Abstract: A resistor structure includes at least an electrically insulating substrate, at least one electrically conductive terminal directly or indirectly provided on the substrate and having a terminal resistivity, at least one resistive trace forming part of a resistive path, the resistive trace directly or indirectly and at least partially provided on the substrate and joined to the terminal and having a trace resistivity, characterized in that at least a portion of the terminal and a portion of the resistive trace are indirectly joined via a junction section having a junction resistivity, wherein the junction resistivity is smaller than the trace resistivity.

公开(公告)号：US20250157703A1

公开(公告)日：2025-05-15

申请号：US18946811

申请日：2024-11-13

Applicant: ABB Schweiz AG

Inventor： Adrian Hozoi ,  Felix Sommer ,  Vadim Migunov ,  Jaromir Podzemny

IPC: H01C7/18 ,  H01C1/14

Abstract: A resistor structure includes at least an electrically insulating substrate in a cylindrical form, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path directly or indirectly and at least partially provided on the substrate and directly or indirectly joined to the terminal, the resistive path running helically at least partially along the cylindrical form of the substrate and comprising at least one resistive trace, wherein the geometry in connection with the resistive path is configured such that an intensity of the electrical field is at least in parts reduced.