I/O MODULE ARRANGEMENT
    1.
    发明申请

    公开(公告)号:US20250103535A1

    公开(公告)日:2025-03-27

    申请号:US18887237

    申请日:2024-09-17

    Applicant: ABB Schweiz AG

    Abstract: An I/O module arrangement for a process control system having a first base plate for at least one I/O module, the first base plate including a first socket for a first I/O module and a first set of connection terminals for connection of the first I/O module to a first set of wires leading to a first group of field devices of the process control system, the first base plate being adapted to allow the first and any other I/O module that is attached to it to be any type of I/O module operating on input and output of any type of field device.

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