公开(公告)号：US20200383239A1

公开(公告)日：2020-12-03

申请号：US16604476

申请日：2018-04-04

Applicant: ABB Schweiz AG

Inventor： Tor Laneryd ,  Thomas Gradinger ,  Heinz Lendenmann ,  Thomas Wagner ,  Hui Huang ,  Kim Missing ,  Mika Norolampi

IPC: H05K7/20 ,  F28F1/40

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the at least one pipe; wherein the at least one heat exchanging element is arranged to press laterally outwards against an internal surface of the at least one pipe to establish a heat transfer bond between the at least one heat exchanging element and the at least one pipe. A subsea electronic system including the heat exchanging arrangement is also provided.

公开(公告)号：US11419241B2

公开(公告)日：2022-08-16

申请号：US16604476

申请日：2018-04-04

Applicant: ABB Schweiz AG

Inventor： Tor Laneryd ,  Thomas Gradinger ,  Heinz Lendenmann ,  Thomas Wagner ,  Hui Huang ,  Kim Missing ,  Mika Norolampi

IPC: H05K7/20 ,  F28F1/40 ,  H01L23/473

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the at least one pipe; wherein the at least one heat exchanging element is arranged to press laterally outwards against an internal surface of the at least one pipe to establish a heat transfer bond between the at least one heat exchanging element and the at least one pipe. A subsea electronic system including the heat exchanging arrangement is also provided.