公开(公告)号：EP3854502A1

公开(公告)日：2021-07-28

申请号：EP20153373.4

申请日：2020-01-23

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: B22F1/00 ,  B22F1/02 ,  C01B32/15 ,  C01B32/182 ,  C01B32/194 ,  C01B32/198 ,  C08K3/04 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00

Abstract: The present invention relates to a composite and a method of its preparation. The composite comprises particles of a metal or a metal alloy; and particles of graphene. In said composite and method at least one particle of metal or metal alloy is coated with at least one particle of graphene.

公开(公告)号：EP3937228A1

公开(公告)日：2022-01-12

申请号：EP20184712.6

申请日：2020-07-08

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: H01L23/427

Abstract: A power electronic assembly comprising a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

公开(公告)号：EP3637461A1

公开(公告)日：2020-04-15

申请号：EP18199846.9

申请日：2018-10-11

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: H01L23/34

Abstract: A power electronic component comprising a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips (3) mounted on a substrate (4) above the bottom surface, and a housing (2) enclosing the one or more power electronic semiconductor chips. The power electronic component comprises a thermal insulator (21; 31; 41; 51) disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator (21; 31; 41; 51) are on the opposite sides of the one or more power electronic semiconductor chips (3).

公开(公告)号：EP3633302A1

公开(公告)日：2020-04-08

申请号：EP18197860.2

申请日：2018-10-01

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: F28D15/02 ,  H01L23/427 ,  H05K7/20

Abstract: A method of manufacturing a heat exchanger and a heat-exchanger comprising a base chamber (11) and one or more condensers (12). The base chamber (11) comprises a top surface (13), a bottom surface (14) and side walls (15) attached to the top surface and the bottom surface, the top surface being adapted to receive one or more heat generating components and the bottom surface comprising one or more elongated openings (16) and the one or more condensers (12) are formed to the bottom surface (14) of the base chamber, extend from the bottom surface and are closed structures having an opening corresponding to the openings of the bottom surface such that the base chamber (11) forms together with the one or more condensers a gas-tight structure having a working fluid enclosed inside the volume of the structure.

公开(公告)号：EP3174093B1

公开(公告)日：2020-10-28

申请号：EP16199913.1

申请日：2016-11-22

Applicant: ABB Schweiz AG

Inventor： Silvennoinen, Mika ,  Manninen, Jorma ,  Pakarinen, Joni

IPC: H01L23/427

公开(公告)号：EP3726572A1

公开(公告)日：2020-10-21

申请号：EP19169398.5

申请日：2019-04-16

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: H01L23/373

Abstract: A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly comprising a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

公开(公告)号：EP3514827A1

公开(公告)日：2019-07-24

申请号：EP18152271.5

申请日：2018-01-18

Applicant: ABB Schweiz AG

Inventor： Silvennoinen, Mika ,  Manninen, Jorma ,  Pakarinen, Joni

IPC: H01L23/367 ,  H01L23/427

Abstract: A heatsink, a heatsink insert and a method of manufacturing a heatsink. The heatsink having a heatsink body (1) with a base plate (2) having a surface arranged to receive a heat source (3) in mating connection. The base plate (2) comprises at least one insert (4) attached to the base plate and made from a material having a higher thermal conductivity than the base plate and the heatsink comprises at least one heat transferring element (5) embedded in the at least one insert (4) and a surface of the at least one insert is adapted to form at least part of the surface that is arranged to receive a heat source (3) in mating connection.

公开(公告)号：EP3696849A1

公开(公告)日：2020-08-19

申请号：EP19157762.6

申请日：2019-02-18

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48

Abstract: 1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of a heat source and the cooling fins are attached to the heatsink base and arranged to extend from the heatsink base. The heatsink base comprises a second surface comprising grooves, the cooling fins comprise carbon-based material and a metallic base at one end of the fins, and the cooling fins are arranged to the grooves such that the metallic bases are in the grooves.

公开(公告)号：EP3893274A1

公开(公告)日：2021-10-13

申请号：EP20168470.1

申请日：2020-04-07

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC: H01L23/427 ,  F28D15/02

Abstract: A cooling element and a method of manufacturing a cooling element. The cooling element comprises a body having a surface adapted to receive a heat source, wherein the body is formed of extrusion profile having open ends. The cooling element further comprises plugs attached to the open ends of the body to close the body, and a port for filling working fluid inside the closed body.

公开(公告)号：EP3589102A1

公开(公告)日：2020-01-01

申请号：EP19181416.9

申请日：2019-06-20

Applicant: ABB Schweiz AG

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Ingman, Kjell

IPC: H05K7/20

Abstract: A heat transfer structure, wherein the structure comprises a metallic body having a first surface and a second surface. The first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and the metallic body comprises a carbon based insert.