公开(公告)号：EP3588713A1

公开(公告)日：2020-01-01

申请号：EP18180883.3

申请日：2018-06-29

Applicant: ABB Schweiz AG

Inventor： Hemrle, Jaroslav ,  Sologubenko, Oleksandr ,  Unternaehrer, Peter ,  Kaufmann, Lilian ,  Rocks, Jens

IPC: H02G5/10

Abstract: A gas-insulated switchgear is disclosed. The gas-insulated switchgear comprises: a housing (2) defining a housing volume (4) for holding a dielectric insulation gas, a conductor arrangement (10) arranged within the housing volume (4) and comprising a conductor section (12) to be cooled, a cooling system (20) for cooling the conductor section (12), the cooling system (20) comprising a spray generator (22) for generating a spray (30) directed at the conductor section (12), the spray (30) comprising liquid droplets of a cooling fluid suspended in the dielectric insulation gas, wherein the dielectric insulation gas is configured to be in a gaseous form at operating temperatures of -30°C and above, and wherein the cooling fluid is configured to have a boiling point of more than 70°C.

公开(公告)号：EP3588707A1

公开(公告)日：2020-01-01

申请号：EP18180881.7

申请日：2018-06-29

Applicant: ABB Schweiz AG

Inventor： Hemrle, Jaroslav ,  Sologubenko, Oleksandr ,  Unternaehrer, Peter ,  Kaufmann, Lilian

IPC: H02B13/025 ,  H02G5/10

Abstract: Two-phase cooling device for electrical components comprising: enclosure (1) having volume (2), inner surface (1a), outer surface (1b) for heat dissipation, evaporator (5) thermally contactable with a component to be cooled (3) in volume (2), liquid reservoir (4) for storing cooling fluid (10) in liquid form and collecting condensed cooling fluid (10) from inner surface (1a) of enclosure (1), cooling conduit (6) leading from liquid reservoir (4) to evaporator (5), with cooling conduit having a diameter creating capillary forces to suck cooling fluid (10) liquid reservoir (4) upwards to evaporator (5), wherein volume (2) of enclosure (1) is filled with dielectric insulation gas having a non-condensable component under standard operating conditions of the cooling device, and under operation cooling fluid (10) flows in a cooling cycle (10a) comprising: evaporating from evaporator (5) into volume (2) by heat uptake from component to be cooled, condensing at inner surface (1a) of enclosure (1), flowing into liquid reservoir (4), and flowing back into evaporator (5) via cooling conduit (6) due to capillary forces.