公开(公告)号：US10253136B2

公开(公告)日：2019-04-09

申请号：US15111937

申请日：2015-01-22

Applicant: ADEKA CORPORATION

Inventor： Takeshi Endo ,  Kozo Matsumoto ,  Daisuke Sato ,  Ryo Ogawa

IPC: C08G59/50 ,  C07D233/58 ,  C07D239/06 ,  C07D249/08 ,  C07D251/14 ,  C08L63/00 ,  C07D235/06 ,  C07D235/08

Abstract: An epoxy resin composition excellent in storage stability and curability is provided. Particularly, a compound of general formula (I) and an epoxy resin composition containing the compound as a curing agent are provided. In formula (I), R1 is a hydrocarbon group optionally containing a nitrogen atom and capable of forming a cyclic structure optionally having a substituent; R2 is a hydrogen atom, an alkyl group, or an aryl group or is taken together with R1 to form an unsaturated bond; R3 is a hydrogen atom, an alkyl group, or an aryl group; and X is a dicyanamide ion or a thiocyanate ion.