公开(公告)号：US20190249047A1

公开(公告)日：2019-08-15

申请号：US16319352

申请日：2017-06-13

Applicant: ADEKA CORPORATION

Inventor： Mitsunori IDE ,  Keisuke OTA ,  Tamotsu NAGAMATSU

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08G18/58 ,  C08G18/80 ,  C08G59/14 ,  C08G59/20 ,  C09J11/06 ,  C09J175/04

Abstract: To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.