公开(公告)号：US20190168308A1

公开(公告)日：2019-06-06

申请号：US16321541

申请日：2017-07-05

Applicant: ADEKA CORPORATION

Inventor： Yusuke NUIDA ,  Hiroshi MORITA

IPC: B22F9/20

Abstract: Provided is a method for producing copper powder, including using, as raw materials, (A) cuprous oxide, (B) at least one selected from the group consisting of boric acid and salts thereof, (C) at least one selected from the group consisting of ammonia and an ammonium ion source, and (D) at least one selected from the group consisting of monosaccharides, disaccharides, and polysaccharides. Component (C) preferably includes at least one selected from the group consisting of ammonia, ammonium chloride, ammonium bromide, ammonium formate, and ammonium acetate.

公开(公告)号：US20240228739A1

公开(公告)日：2024-07-11

申请号：US18556274

申请日：2022-05-10

Applicant: ADEKA CORPORATION

Inventor： Takashige IKEDA ,  Yusuke NUIDA

IPC: C08K3/08 ,  C08J7/04 ,  C08K5/00 ,  C08K9/04 ,  C08L63/00

CPC classification number: C08K3/08 ,  C08J7/04 ,  C08K5/0025 ,  C08K9/04 ,  C08L63/00 ,  C08J2363/00 ,  C08K2003/0806 ,  C08K2003/085

Abstract: There is provided a composition that makes it possible to produce a cured product having a low volume resistance value, a cured product obtained by curing the composition, and a method for producing a cured product using the composition. The composition contains a component (A): at least metal particles selected from the group consisting of copper particles and silver particles, a component (B): at least one cashew component selected from the group consisting of cashew oils and cashew oil-modified resins, and a component (C): a curing agent. The cured product is obtained by curing the composition. The method for producing a cured product includes a coating step of coating a substrate with the composition and a curing step of heating the substrate coated with the composition to cure the composition.

公开(公告)号：US20220282059A1

公开(公告)日：2022-09-08

申请号：US17632685

申请日：2020-08-11

Applicant: ADEKA CORPORATION

Inventor： Yusuke NUIDA ,  Hitoshi HOSOKAWA ,  Hiroshi MORITA

IPC: C08K3/08 ,  C08G59/14

Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 μm, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

公开(公告)号：US20200001371A1

公开(公告)日：2020-01-02

申请号：US16484268

申请日：2017-12-07

Applicant: ADEKA CORPORATION

Inventor： Yusuke NUIDA ,  Hiroshi MORITA

IPC: B22F9/24 ,  B22F1/00 ,  C08L57/00 ,  C08L61/04 ,  C08L67/00

Abstract: A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.