公开(公告)号：JPH0677357A

公开(公告)日：1994-03-18

申请号：JP15331893

申请日：1993-06-24

Applicant: ADVANCED MICRO DEVICES INC

Inventor： DEIBITSUTO ESU OOIENGU

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367

Abstract: PURPOSE: To provide a molded heat sink for a plastic package which is constructed to receive a semiconductor device. CONSTITUTION: Heat is removed from a semiconductor device with direct heat transfer from the device, through an upright member 68 formed integrally with the upper part of a plastic housing. The integrally molded heat dissipation member 68 facilitates cooling of the semiconductor die not utilizable with normal dissipation, due to convection and thermal radiation through a generally planar outer surface of a package 60. The molded member enables effective heat dissipation without accompanying mismatch of thermal expansion coefficients which can occur between the conventional molded package 60 and a heat sink fixed thereto.