公开(公告)号：US20230051824A1

公开(公告)日：2023-02-16

申请号：US17969012

申请日：2022-10-19

Applicant: AGC Inc.

Inventor： Toru MOMOSE ,  Osamu SATO ,  Hirofumi YAMAMOTO ,  Nobuhiko TAKESHITA

IPC: B24B37/08 ,  B24B37/28

Abstract: A method of producing a glass article includes holding a carrier having a circular shape, in which a glass substrate having a circular shape is retained, with an upper surface plate and a lower surface plate; and polishing the glass substrate by rotating the carrier with respect to the upper surface plate and the lower surface plate, to obtain the glass article. The glass substrate is disposed in the carrier such that, in a top plan view, a center of the carrier is included in a region of the glass substrate, and a center of the glass substrate is shifted from the center of the carrier.

公开(公告)号：US20210163341A1

公开(公告)日：2021-06-03

申请号：US17174615

申请日：2021-02-12

Applicant: AGC Inc.

Inventor： Kazutaka ONO ,  Shuhei NOMURA ,  Nobutaka KIDERA ,  Nobuhiko TAKESHITA

IPC: C03C3/089 ,  C03B25/08 ,  C03B19/14 ,  C03C3/091 ,  C03C4/16 ,  H05K1/03 ,  C03B17/02 ,  C03B17/06 ,  H05K1/02

Abstract: A glass substrate for a high-frequency device, which contains, in terms of mole percent on the basis of oxides: 40 to 75% of SiO2; 0 to 15% of Al2O3; 13 to 23% of B2O3; 2.5 to 11% of MgO; and 0 to 13% of CaO, and having a total content of alkali metal oxides in the range of 0.001-5%, where at least one main surface of the glass substrate has a surface roughness of 1.5 um or less in terms of arithmetic average roughness Ra. and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

公开(公告)号：US20240317631A1

公开(公告)日：2024-09-26

申请号：US18734875

申请日：2024-06-05

Applicant: AGC Inc.

Inventor： Kazutaka ONO ,  Shuhei NOMURA ,  Nobutaka KIDERA ,  Nobuhiko TAKESHITA

IPC: C03C3/089 ,  C03B17/02 ,  C03B17/06 ,  C03B19/14 ,  C03B25/08 ,  C03C3/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/118 ,  C03C4/16 ,  C03C13/04 ,  H05K1/02 ,  H05K1/03

CPC classification number: C03C3/089 ,  C03C3/091 ,  C03C4/16 ,  H05K1/024 ,  H05K1/03 ,  C03B17/02 ,  C03B17/064 ,  C03B19/14 ,  C03B25/08 ,  C03C3/06 ,  C03C3/087 ,  C03C3/118 ,  C03C13/046 ,  C03C2204/08 ,  C03C2217/253

Abstract: A glass substrate for a high-frequency device, which contains, in terms of mole percent on the basis of oxides: 40 to 75% of SiO2; 0 to 15% of Al2O3; 13 to 23% of B2O3; 2.5 to 11% of MgO; and 0 to 13% of CaO, and having a total content of alkali metal oxides in the range of 0.001-5%, where at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

公开(公告)号：US20240227117A1

公开(公告)日：2024-07-11

申请号：US18616813

申请日：2024-03-26

Applicant: AGC Inc.

Inventor： Toru MOMOSE ,  Osamu SATO ,  Hirofumi YAMAMOTO ,  Nobuhiko TAKESHITA

IPC: B24B37/08 ,  B24B37/28

CPC classification number: B24B37/08 ,  B24B37/28

Abstract: A method of producing a glass article includes holding a carrier having a circular shape, in which a glass substrate having a circular shape is retained, with an upper surface plate and a lower surface plate; and polishing the glass substrate by rotating the carrier with respect to the upper surface plate and the lower surface plate, to obtain the glass article. The glass substrate is disposed in the carrier such that, in a top plan view, a center of the carrier is included in a region of the glass substrate, and a center of the glass substrate is shifted from the center of the carrier.

公开(公告)号：US20210343610A1

公开(公告)日：2021-11-04

申请号：US17367762

申请日：2021-07-06

Applicant: AGC Inc.

Inventor： Yu HANAWA ,  Shigeki SAWAMURA ,  Shuhei NOMURA ,  Kazutaka ONO ,  Nobuhiko TAKESHITA ,  Keisuke HANASHIMA

IPC: H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.