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公开(公告)号：JPH11283807A
公开(公告)日：1999-10-15
申请号：JP9997498
申请日：1998-03-30
Applicant: ALPHA ELECTRONICS KK
Inventor： SUZUKI MASAYUKI , SATO MAKIO
Abstract: PROBLEM TO BE SOLVED: To improve accuracy and to stabilize characteristics by preventing shock or stresses from being added to a substrate, etc., inside of a resistor from a plate-like lead adheringly fixed to an insulated substrate in a surface mounted metal foil resistor obtained by forming a resistor pattern at a metal foil resistor which adhered to one side face of the insulated substrate and is resin-encapsulated. SOLUTION: This resistor is provided with plural plate-like leads 20 adhered to the other side face of a substrate and projecting outward from the side edge of the substrate, a bonding wire connecting a resistor pattern to the leads 20 and encapsulating resin for sealing the substrate and the bonding wire. Each of the plate-like leads is provided with a small hole near a position crossing a boundary with the outer peripheral surface of the sealing resin, and the leads 20 are folded at the positions of these small holes. The small hole formed at each lead 20 is desirably a long hole 26, which is long in the longitudinal direction of the lead 20.
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公开(公告)号：JPH11283806A
公开(公告)日：1999-10-15
申请号：JP9997398
申请日：1998-03-30
Applicant: ALPHA ELECTRONICS KK
Inventor： SUZUKI MASAYUKI , SATO MAKIO
Abstract: PROBLEM TO BE SOLVED: To increase the level of mounting density by miniaturizing in a surface mounted resistor obtained by forming a resistance pattern on one face of a nearly quadrilateral insulated substrate and is resin-encapsulated it. SOLUTION: This resistor is provided with plural wire bonding regions successively formed along one edge of a substrate, first leads 20A and 20C whose inner tips projecte to the side of the wire bonding regions of the substrate across the other face of the substrate and whose outer tips are extended outward from a side opposite to the wire bonding regions of the substrate, a second lead 20B whose inner tip is fixed to the other face of the substrate and whose outer tip is extended outward from the side of the wire bonding regions of the substrate, and a bonding wire connecting the projecting parts of the inner tips of the first leads 20A and 20C and the second lead 20B to the wire bonding regions of the substrate.
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公开(公告)号：JPH11283805A
公开(公告)日：1999-10-15
申请号：JP9997298
申请日：1998-03-30
Applicant: ALPHA ELECTRONICS KK
Inventor： SUZUKI MASAYUKI , SATO MAKIO
Abstract: PROBLEM TO BE SOLVED: To even a temperature distribution along a longitudinal direction of each plate lead of a substrate by the method wherein at least three plate leads is so bonded with another surface of the substrate so as to be in parallel each other and to almost cross the substrate at a predetermined interval in the longitudinal direction of each plate lead. SOLUTION: Inner terminals of plate leads 20A to 20C are so bonded on another surface of resistor chips, that is on the surface where a resistor 12 is not pasted as to have same intervals and to be in parallel in the width direction of each plate lead 20A to 20C. Each plate lead 20A to 20C is so bonded on the substrate 10 as to almost cross the substrate 10. Outer terminals of the plate leads 20A to 20C are alternately extended outside from two sides facing the substrate 10. Additionally press bonded parts 18A to 18C of a resistor pattern of the substrate 10 and press bonded parts 24A to 24C of the plate leads 20A to 20C are connected with a bonding wire 32. After that the substrate is sealed by resin. Thus a temperature characteristic of the resistor element is stabilized and a precision of resistance valve is improved.
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