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公开(公告)号：WO2008079887A2
公开(公告)日：2008-07-03
申请号：PCT/US2007088166
申请日：2007-12-19
Applicant: ANALOG DEVICES INC , O SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
Inventor： O'SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
IPC: B81C1/00
CPC classification number: B81B7/007 , B81B2201/014 , B81B2207/015 , B81B2207/017 , B81C1/0023 , B81C2203/032 , H01H59/0009 , H01L2924/0002 , H01L2924/00
Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
Abstract translation: MEMS装置具有夹在基座和电路芯片之间的MEMS器件。 MEMS器件的可移动部件的一侧上靠在电路芯片上。 可移动部件可以安装在MEMS器件的基板上，或直接形成在电路芯片上的钝化层上。 电路芯片通过引线键合，通过MEMS器件的通孔或导电路径（例如MEMS器件外部的焊球）向MEMS器件提供控制信号。
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公开(公告)号：WO2008079887A3
公开(公告)日：2009-01-29
申请号：PCT/US2007088166
申请日：2007-12-19
Applicant: ANALOG DEVICES INC , O SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
Inventor： O'SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
IPC: B81C1/00
CPC classification number: B81B7/007 , B81B2201/014 , B81B2207/015 , B81B2207/017 , B81C1/0023 , B81C2203/032 , H01H59/0009 , H01L2924/0002 , H01L2924/00
Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
Abstract translation: MEMS装置具有夹在基座和电路芯片之间的MEMS器件。 MEMS器件的可移动部件的一侧上靠在电路芯片上。 可移动部件可以安装在MEMS器件的基板上，或直接形成在电路芯片上的钝化层上。 电路芯片通过引线键合，通过MEMS器件的通孔或导电路径（例如MEMS器件外部的焊球）向MEMS器件提供控制信号。
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3.发明公开MICRO-ELECTRO-MECHANICAL SWITCH BEAM CONSTRUCTION WITH MINIMIZED BEAM DISTORTION AND METHOD FOR CONSTRUCTING 审中-公开带杆结构的微电子机械开关，最小限度地损坏和施工过程
公开(公告)号：EP2377138A4
公开(公告)日：2014-04-16
申请号：EP09837894
申请日：2009-12-16
Applicant: ANALOG DEVICES INC
Inventor： ELLIS DENIS , FITZGERALD PADRAIG , WONG JO-EY , GOGGIN RAYMOND , ECKL RICHARD TARIK
CPC classification number: H01H11/00 , B81B3/0081 , B81B2201/014 , H01H1/0036 , H01H59/0009 , Y10T29/49002 , Y10T29/49105
Abstract: Disclosed is a micro-electro-mechanical switch, including a substrate having a gate connection, a source connection, a drain connection and a switch structure, coupled to the substrate. The switch structure includes a beam member, an anchor and a hinge. The beam member having a length sufficient to overhang both the gate connection and the drain connection. The anchor coupling the switch structure to the substrate, the anchor having a width. The hinge coupling the beam member to the anchor at a respective position along the anchor's length, the hinge to flex in response to a charge differential established between the gate and the beam member. The switch structure having gaps between the substrate and the anchor in regions proximate to the hinges.
Abstract translation: 公开了一种微机电开关，其包括耦合到衬底的具有栅极连接的衬底，源极连接，漏极连接和开关结构。 开关结构包括梁构件，锚和铰链。 所述梁构件具有足以突出所述栅极连接和所述排水连接两端的长度。 该锚固件将开关结构耦合到基板，该锚具有一宽度。 铰链将梁构件沿着锚固件的长度在相应位置处联接到锚固件，铰链响应于门和梁构件之间建立的电荷差异而弯曲。 开关结构在接近铰链的区域中在基板和锚固件之间具有间隙。
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4.发明公开
公开(公告)号：EP2556014A4
公开(公告)日：2014-11-26
申请号：EP11766622
申请日：2011-04-06
Applicant: ANALOG DEVICES INC
Inventor： GOGGIN RAYMOND , FITZGERALD PADRAIG
CPC classification number: H01H57/00 , B81B7/0012 , B81B2201/014 , H01H59/0009
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