公开(公告)号：WO2022171799A1

公开(公告)日：2022-08-18

申请号：PCT/EP2022/053374

申请日：2022-02-11

Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

Inventor： GEALON, Johnny Solana ,  BATHAN, Gharry Maala ,  SATSATIN, Jettro Alcantara ,  LEE, Chai Wong ,  IGNACIO, Johann Philip Trinidad

IPC: G01H1/00 ,  G01M13/028 ,  G01M13/045 ,  G10K11/18 ,  G01D11/00

Abstract: A sensor package is disclosed. The sensor package can include a support structure that is configured to couple with a vibration source by way of a stud. The sensor package can include a cap that is at least partially disposed over the support structure. The cap at least partially defines a cavity. The sensor package can include a vibration sensor module that is coupled to a portion of the support structure and disposed in the cavity. The sensor package can have a mechanical resonant frequency in a range of 0.1 Hz to 11 kHz. The sensor package can include a connector that is coupled to the support structure. The connector can connect to a connection line to electrically connect the vibration sensor module to an external substrate or system. The support structure can include a material that has a Young's modulus of at least 60 GPa and a density less than 3000 kg/m3. The sensor package can include a filler material disposed in the cavity.