公开(公告)号：AU2017324146B9

公开(公告)日：2020-07-16

申请号：AU2017324146

申请日：2017-08-28

Applicant: APPLE INC

Inventor： CATER TYLER B ,  POPE BENJAMIN J ,  MYERS SCOTT A ,  BUSTLE BENJAMIN SHANE ,  YANG TSENG-MAU ,  BRINKMAN ADAM J

IPC: H04M1/02 ,  H01Q1/24

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

公开(公告)号：AU2020202674A1

公开(公告)日：2020-05-14

申请号：AU2020202674

申请日：2020-04-21

Applicant: APPLE INC

Inventor： CATER TYLER B ,  POPE BENJAMIN J ,  MYERS SCOTT A ,  BUSTLE BENJAMIN SHANE ,  YANG TSENG-MAU ,  BRINKMAN ADAM J

IPC: H04M1/02 ,  H01Q1/24

Abstract: An enclosure or housing for a portable electronic device includes a first portion with a first interlocking micro-feature and second portion comprising a second interlocking micro-feature. A dielectric element fills a channel formed by the portions and/or the first and second interlocking micro-features to interlock the first portion with the second portion.

公开(公告)号：AU2017324146B2

公开(公告)日：2020-02-27

申请号：AU2017324146

申请日：2017-08-28

Applicant: APPLE INC

Inventor： CATER TYLER B ,  POPE BENJAMIN J ,  MYERS SCOTT A ,  BUSTLE BENJAMIN SHANE ,  YANG TSENG-MAU ,  BRINKMAN ADAM J

IPC: H04M1/02 ,  H01Q1/24

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

公开(公告)号：AU2017324146A1

公开(公告)日：2018-10-25

申请号：AU2017324146

申请日：2017-08-28

Applicant: APPLE INC

Inventor： CATER TYLER B ,  POPE BENJAMIN J ,  MYERS SCOTT A ,  BUSTLE BENJAMIN SHANE ,  YANG TSENG-MAU ,  BRINKMAN ADAM J

IPC: H04M1/02 ,  H01Q1/24

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.