公开(公告)号：DE102024125993A1

公开(公告)日：2025-03-13

申请号：DE102024125993

申请日：2024-09-10

Applicant: APPLE INC

Inventor： AMINI MAHMOUD R ,  WANKOFF ERIC B ,  PANSARE NIKHIL S ,  KAMEI IBUKI ,  CHIZARI SAMIRA ,  CAMERON PETER J

IPC: H01R13/533 ,  H01R13/52 ,  H01R24/62

Abstract: Verbinderstrukturen, die dazu beitragen können, die Korrosion von Kontakten in einer Verbinderaufnahme zu verringern und das Eindringen von Flüssigkeit in eine elektronische Vorrichtung, in der sich die Verbinderaufnahme befindet, zu reduzieren. Beispielsweise kann die effektive Breite zwischen benachbarten Kontakten vergrößert werden. Dieses und andere Beispiele können erzwingen, dass dendritisches Wachstum an einer Stelle stattfindet, an der es durch das Einführen eines entsprechenden Verbinders in die Verbinderaufnahme zumindest teilweise beseitigt werden kann.

公开(公告)号：AU2013204685A1

公开(公告)日：2014-03-27

申请号：AU2013204685

申请日：2013-04-12

Applicant: APPLE INC

Inventor： GOLKO ALBERT J ,  STANLEY CRAIG M ,  THOMPSON PAUL J ,  JONES WARREN Z ,  KAMEI IBUKI

IPC: H01R13/52

Abstract: A plug connector module that includes a metal frame having a base portion, an insertion end and a cavity that extends from the base portion into the insertion end. The insertion end is configured to be inserted into a cavity of a corresponding receptacle connector. A substrate extends through the base portion of the frame and into the insertion end and has a plurality of contact bonding pads at one end positioned within the frame, a plurality of conductor bonding pads at the opposing end and at least one ground pad contact between the contact bonding pads and conductor bonding pads. A first plurality of external contacts is positioned in a first opening and bonded to some of the plurality of contact bonding pads on the substrate and a second plurality of contacts positioned within a second opening and bonded to some of the plurality of contact bonding pads on the substrate. One or more electronic components coupled to the substrate. A first encapsulant that covers and environmentaly seals the one or more electronic components. A metal shield coupled to the base portion of the metal frame and encasing a portion of the substrate and the one or more electronic components, the metal shield having a leg that is substantially perpendicular to the substrate and coupled to the substrate at the ground pad, and a second encapsulant that covers and environmentally seals the ground pad and at least a portion of the leg. 65354894v.] 108a 105c 106a 102a10 106Fi.1 106(1)..(8 59 59 -, 105 p Ap fu 102'~ U 102 b U ~102b 112' 106a 106b 105C I105b

公开(公告)号：DE102013207940A1

公开(公告)日：2014-03-13

申请号：DE102013207940

申请日：2013-04-30

Applicant: APPLE INC

Inventor： STANLEY CRAIG M ,  JONES WARREN Z ,  KAMEI IBUKI ,  THOMPSON PAUL J ,  GOLKO ALBERT J

IPC: H01R24/00

Abstract: Ein Steckverbindermodul, das einen Metallrahmen umfasst, mit einem Basisabschnitt, einem Einschubende und einer Kavität, die sich von dem Basisabschnitt bis zu dem Einschubende erstreckt. Das Einschubende ist konfiguriert, in eine Kavität einer entsprechenden Steckerbuchse eingesteckt zu werden. Ein Substrat erstreckt sich durch den Basisabschnitt des Rahmens und in das Einschubende und hat eine Vielzahl von Kontaktanschlusspads an einem im Rahmen angeordneten Ende, eine Vielzahl von Leiteranschlusspads am gegenüberliegenden Ende und mindestens einen Massepadkontakt zwischen den Kontaktanschlusspads und den Leiteranschlusspads. Eine erste Vielzahl externer Kontakte ist in einer ersten Öffnung angeordnet und mit einigen der Vielzahl von Kontaktanschlusspads auf dem Substrat verbunden, und eine zweite Vielzahl von Kontakten ist in einer zweiten Öffnung angeordnet und mit einigen der Vielzahl von Kontaktanschlusspads auf dem Substrat verbunden. Eine oder mehrere elektronische Komponenten gekoppelt an das Substrat. Eine erste Umhüllung, die die eine oder die mehreren elektronischen Komponenten abdeckt und von der äußeren Umwelt versiegelt. Eine Metallabschirmung, die mit dem Basisabschnitt des Metallrahmens gekoppelt ist und einen Abschnitt des Substrats und die eine oder die mehreren elektronischen Komponenten umhüllt, wobei die Metallabschirmung einen Fuß aufweist, der im Wesentlichen senkrecht zu dem Substrat angeordnet ist und an dem Massepad mit dem Substrat gekoppelt ist, und eine zweite Umhüllung, die das Massepad und mindestens einen Abschnitt des Fußes bedeckt und vor der äußeren Umwelt versiegelt.

公开(公告)号：AU2018201067B2

公开(公告)日：2019-04-18

申请号：AU2018201067

申请日：2018-02-14

Applicant: APPLE INC

Inventor： WAGMAN DANIEL ,  ROSS OLIVER ,  JOL ERIC S ,  ESMAEILI HANI ,  DEGNER BRETT ,  KAMEI IBUKI

IPC: G06F1/16

Abstract: An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.

公开(公告)号：AU2018201067A1

公开(公告)日：2018-03-08

申请号：AU2018201067

申请日：2018-02-14

Applicant: APPLE INC

Inventor： WAGMAN DANIEL ,  ROSS OLIVER ,  JOL ERIC S ,  ESMAEILI HANI ,  DEGNER BRETT ,  KAMEI IBUKI

IPC: G06F1/16

Abstract: An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.

公开(公告)号：AU2016225784B2

公开(公告)日：2018-01-18

申请号：AU2016225784

申请日：2016-09-05

Applicant: APPLE INC

Inventor： WAGMAN DANIEL ,  ROSS OLIVER ,  JOL ERIC S ,  ESMAEILI HANI ,  DEGNER BRETT ,  KAMEI IBUKI

IPC: G06F1/16

Abstract: An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and 5 substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.

公开(公告)号：AU2016225784A1

公开(公告)日：2017-03-23

申请号：AU2016225784

申请日：2016-09-05

Applicant: APPLE INC

Inventor： WAGMAN DANIEL ,  ROSS OLIVER ,  JOL ERIC S ,  ESMAEILI HIVA ,  DEGNER BRETT ,  KAMEI IBUKI

IPC: G06F1/16

Abstract: An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and 5 substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.

公开(公告)号：AU2013204685B2

公开(公告)日：2014-10-02

申请号：AU2013204685

申请日：2013-04-12

Applicant: APPLE INC

Inventor： GOLKO ALBERT J ,  STANLEY CRAIG M ,  THOMPSON PAUL J ,  JONES WARREN Z ,  KAMEI IBUKI

IPC: H01R13/52

Abstract: A plug connector module that includes a metal frame having a base portion, an insertion end and a cavity that extends from the base portion into the insertion end. The insertion end is configured to be inserted into a cavity of a corresponding receptacle connector. A substrate extends through the base portion of the frame and into the insertion end and has a plurality of contact bonding pads at one end positioned within the frame, a plurality of conductor bonding pads at the opposing end and at least one ground pad contact between the contact bonding pads and conductor bonding pads. A first plurality of external contacts is positioned in a first opening and bonded to some of the plurality of contact bonding pads on the substrate and a second plurality of contacts positioned within a second opening and bonded to some of the plurality of contact bonding pads on the substrate. One or more electronic components coupled to the substrate. A first encapsulant that covers and environmentaly seals the one or more electronic components. A metal shield coupled to the base portion of the metal frame and encasing a portion of the substrate and the one or more electronic components, the metal shield having a leg that is substantially perpendicular to the substrate and coupled to the substrate at the ground pad, and a second encapsulant that covers and environmentally seals the ground pad and at least a portion of the leg. 65354894v.] 108a 105c 106a 102a10 106Fi.1 106(1)..(8 59 59 -, 105 p Ap fu 102'~ U 102 b U ~102b 112' 106a 106b 105C I105b

公开(公告)号：HK1193506A1

公开(公告)日：2014-09-19

申请号：HK14106801

申请日：2014-07-04

Applicant: APPLE INC

Inventor： THOMPSON PAUL J ,  GOLKO ALBERT J ,  STANLEY CRAIG M ,  JONES WARREN Z ,  KAMEI IBUKI

IPC: H01R20060101

Abstract: A plug connector module (100) including a metal frame (105) with a cavity, a substrate (104) inside the frame. The substrate includes several contact pads on one side located on the top face and bottom face of the substrate. Both set of contacts pads are connected to external contacts (106(1)-106(16)) located inside frame top and bottom openings. On the other side of the substrate are located several conductor pads (110). Between contact and conductor bonding pads the substrate includes ground pads (112). Electronic components (108a, 108b) are coupled to the substrate. A first encapsulant (205) seals the electronic components. A metal shield (210) coupled to the base portion of the metal frame and encasing a portion of the substrate and the one or more electronic components, the metal shield includes a leg (220) perpendicular to the substrate coupled to the ground pad, and a second encapsulant (250) that seals the ground pad and at least a portion of the leg.

公开(公告)号：WO2016025106A8

公开(公告)日：2016-07-28

申请号：PCT/US2015039769

申请日：2015-07-09

Applicant: APPLE INC

Inventor： SOOHOO ERIC T ,  JOL ERIC S ,  KAMEI IBUKI

IPC: H01R13/405 ,  B29C45/14 ,  H01R12/57 ,  H01R13/6477 ,  H01R13/66 ,  H01R24/60

CPC classification number: H01R13/665 ,  H01R4/02 ,  H01R12/57 ,  H01R13/405 ,  H01R13/52 ,  H01R13/6477 ,  H01R13/6658 ,  H01R24/60

Abstract: A high-speed electrical connector (100) employs a plurality of electrical contacts (120(1)..120(8)) held together by a dielectric frame (205). The contacts (120(1)..120(8)) are soldered a substrate (215) within the connector (100). A gasket (218) is compressed between the dielectric frame (205) and the substrate (215)and configured to block the flow of an overmold material between the dielectric frame (205) and the substrate (215) such that voids (250) are formed between the contacts (120(1)..120(8)). The dielectric frame (205) and the overmold (230) may be made from materials containing silica aerogel. The voids (250) and the aerogel materials result in reduced parasitic capacitance between the contacts (120(1)..120(8)) enabling higher data transfer speeds.

Abstract translation: 高速电连接器（100）采用通过电介质框架（205）保持在一起的多个电触头（120（1）... 120（8））。 触点（120（1）... 120（8））在连接器（100）内焊接衬底（215）。 衬垫（218）在电介质框架（205）和衬底（215）之间被压缩并被构造成阻挡介电框架（205）和衬底（215）之间的包覆模制材料的流动，使得空隙（250）为 形成在触点（120（1）... 120（8））之间。 电介质框架（205）和包覆模制件（230）可以由含有二氧化硅气凝胶的材料制成。 空隙（250）和气凝胶材料导致触点（120（1）... 120（8））之间的寄生电容降低，从而实现更高的数据传输速度。