公开(公告)号：AU2014308574A1

公开(公告)日：2016-03-10

申请号：AU2014308574

申请日：2014-08-25

Applicant: APPLE INC

Inventor： AMINI MAHMOUD R ,  GAO ZHENG ,  PYPER DENNIS R

IPC: B23C3/12 ,  H01R13/6473 ,  H01R13/66 ,  H01R24/60 ,  H05K3/10 ,  H05K3/24

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

公开(公告)号：AU2014308574B2

公开(公告)日：2018-02-15

申请号：AU2014308574

申请日：2014-08-25

Applicant: APPLE INC

Inventor： AMINI MAHMOUD R ,  GAO ZHENG ,  PYPER DENNIS R

IPC: B23C3/12 ,  H01R13/6473 ,  H01R13/66 ,  H01R24/60 ,  H05K3/10 ,  H05K3/24

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

公开(公告)号：DE112014003876T5

公开(公告)日：2016-05-12

申请号：DE112014003876

申请日：2014-08-25

Applicant: APPLE INC

Inventor： GAO ZHENG ,  PYPER DENNIS R ,  AMINI MAHMOUD R

IPC: H01R13/66 ,  B23C3/12 ,  H01R13/6473 ,  H01R24/60 ,  H05K3/10 ,  H05K3/24

Abstract: Steckverbindereinsätze und andere Strukturen, die eine hohe Signalintegrität und eine niedrige Einfügungsdämpfung haben, sind zuverlässig und leicht herzustellen. Ein Beispiel kann einen Steckverbindereinsatz bereitstellen, der im Wesentlichen unter Verwendung einer Leiterplatte gebildet ist. Kontakte auf dem Steckverbindereinsatz können Kontakten auf einer Leiterplatte ähnlich sein und sie können mit Leiterbahnen mit angepassten Impedanzen auf der Leiterplatte verbunden sein, um die Signalintegrität zu verbessern und die Einfügungsdämpfung zu reduzieren. Die Leiterplatte kann auf eine Weise hergestellt werden, die eine erhöhte Zuverlässigkeit zur Folge hat. Zur Verbesserung der Herstellbarkeit können Plattierung, Lötblock und andere Herstellungsschritte, die der Herstellung von Leiterplatten eigen sind, angewendet werden. Es können Spezialwerkzeuge benutzt werden, die eine abgefaste Kante an den Steckverbindereinsätzen bereitstellen können.

公开(公告)号：WO2015027239A4

公开(公告)日：2015-08-27

申请号：PCT/US2014052538

申请日：2014-08-25

Applicant: APPLE INC

Inventor： AMINI MAHMOUD R ,  GAO ZHENG ,  PYPER DENNIS R

IPC: H01R13/66 ,  B23C3/12 ,  H01R13/6473 ,  H01R24/60 ,  H05K3/10 ,  H05K3/24

CPC classification number: H05K1/0296 ,  B23C3/12 ,  B23C5/04 ,  B23C5/12 ,  B23C2210/086 ,  B23C2210/088 ,  B23C2210/244 ,  B23C2220/16 ,  B23C2226/27 ,  H01R13/6473 ,  H01R13/6658 ,  H01R24/60 ,  H01R2201/06 ,  H05K1/0227 ,  H05K1/025 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/06 ,  H05K3/10 ,  H05K3/108 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/09027 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09445 ,  H05K2203/1469

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Abstract translation: 具有高信号完整性和低插入损耗的连接器插件和其他结构是可靠的，并且容易制造。 一个示例可以提供主要使用印刷电路板形成的连接器插件。 连接器插入件上的触点可以类似于印刷电路板上的触点，并且它们可以连接到在印刷电路板上具有匹配阻抗的迹线，以便改善信号完整性并减少插入损耗。 可以以增加可靠性的方式制造印刷电路板。 可以采用印刷电路板制造中的电镀，焊料块和其他制造步骤来提高可制造性。 可以使用可能在连接器插入件上提供倒角边缘的专用工具。

公开(公告)号：WO2015027239A2

公开(公告)日：2015-02-26

申请号：PCT/US2014052538

申请日：2014-08-25

Applicant: APPLE INC

Inventor： AMINI MAHMOUD R ,  GAO ZHENG ,  PYPER DENNIS R

IPC: H01R13/66

CPC classification number: H05K1/0296 ,  B23C3/12 ,  B23C5/04 ,  B23C5/12 ,  B23C2210/086 ,  B23C2210/088 ,  B23C2210/244 ,  B23C2220/16 ,  B23C2226/27 ,  H01R13/6473 ,  H01R13/6658 ,  H01R24/60 ,  H01R2201/06 ,  H05K1/0227 ,  H05K1/025 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/06 ,  H05K3/10 ,  H05K3/108 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/09027 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09445 ,  H05K2203/1469

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.