公开(公告)号：HK1156465A1

公开(公告)日：2012-06-08

申请号：HK11110716

申请日：2011-10-11

Applicant: APPLE INC

Inventor： SCOTT MYERS S ,  MATTIA PASCOLINI M ,  RICHARD DINH R ,  TRENT WEBER T ,  ROBERT SCHLUB R ,  JOSH NICKEL J ,  ROBERT HILL R ,  NANBO JIN ,  TANG TAN

IPC: H05K20060101 ,  H01Q20060101

公开(公告)号：HK1160338A1

公开(公告)日：2012-08-10

申请号：HK12100356

申请日：2012-01-12

Applicant: APPLE INC

Inventor： RHM RICHARD HUNG MINH DINH ,  TAN TANG YEW ,  NI NICHOLAUS I LUBINSKI ,  JASON SLOEY J ,  SHAYAN MALEK S ,  SA SCOTT A MYERS ,  WYEMAN CHEN W ,  DR DENNIS R PYPER ,  DP DOUGLAS P KIDD ,  RW RONALD W DIMPFLMAIER ,  AB ANDREW B JUST ,  JG JOSHUA G WURZEL ,  DA DAVID A PAKULA ,  TRENT WEBER T ,  DW DANIEL W JARVIS

IPC: H05K20060101 ,  G03B20060101 ,  H01R20060101

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.