公开(公告)号：SG10201908828WA

公开(公告)日：2021-04-29

申请号：SG10201908828W

申请日：2019-09-23

Applicant: APPLE INC

Inventor： RENJAN KISHORE N ,  KANI BILAL MOHAMED IBRAHIM ,  KIM KYUSANG ,  VADEENTAVIDA MANOJ ,  LUPO PIERPAOLO ,  HOLENARSIPUR PRASHANTH S ,  CHANDRAN PRAVEESH ,  BABU VINODH ,  KUBOYAMA YUTA

IPC: H05K1/18 ,  H01L23/538 ,  H01L25/16 ,  H05K3/46

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.