公开(公告)号：HK1150488A1

公开(公告)日：2011-12-30

申请号：HK11104484

申请日：2011-05-05

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  WANG ERIK

IPC: H05K20060101

Abstract: An electromagnetic interference shield system, is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.

公开(公告)号：WO2010068340A3

公开(公告)日：2010-09-16

申请号：PCT/US2009061883

申请日：2009-10-23

Applicant: APPLE INC ,  HELEY RICHARD WALTER ,  LUO ERMING ,  MITTLEMAN ADAM ,  PAYNE JOHN ,  TAN TANG YEW ,  WANG ERIK

Inventor： HELEY RICHARD WALTER ,  LUO ERMING ,  MITTLEMAN ADAM ,  PAYNE JOHN ,  TAN TANG YEW ,  WANG ERIK

IPC: G03F7/20

CPC classification number: H05K13/00 ,  G03F7/20 ,  G03F7/2014 ,  G03F7/2016 ,  G03F7/202 ,  Y10T428/2462

Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface.

Abstract translation: 公开了在产品上提供标记的技术或方法。 产品上提供的标记可以是文字和/或图形。 这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。 在一个实施例中，产品具有外壳，并且标记将设置在外壳上。 例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上。