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1.发明专利Method for integrally trapping glass insert in metal bezel, and produced electronic device 有权金属贝茨玻璃插件和生产电子设备的全方位追踪方法
公开(公告)号：JP2013173188A
公开(公告)日：2013-09-05
申请号：JP2013096107
申请日：2013-05-01
Applicant: Apple Inc , アップル インコーポレイテッド
Inventor： YEATES KYLE
CPC classification number: B22D19/00 , B22D19/04 , C03C27/02 , G06F1/1656 , H05K7/02 , Y10T29/49826 , Y10T428/2457
Abstract: PROBLEM TO BE SOLVED: To disclose a method and apparatus for forming an overall assembly including a transparent member and a metal member.SOLUTION: A method includes positioning a transparent member in a mold configured for insertion molding, providing a liquid metal into the mold and hardening the liquid metal in the mold. Hardening the liquid metal includes binding the metal to the transparent member to create an integral assembly.
Abstract translation: 要解决的问题：公开一种用于形成包括透明构件和金属构件的整体组件的方法和装置。解决方案：一种方法包括将透明构件定位在构造成用于插入成型的模具中，将液态金属提供到模具中， 硬化模具中的液态金属。 硬化液体金属包括将金属粘合到透明构件以形成整体组件。
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公开(公告)号：BRPI0918975A2
公开(公告)日：2015-12-01
申请号：BRPI0918975
申请日：2009-07-16
Applicant: APPLE INC
Inventor： LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN , DABOV TEODOR
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公开(公告)号：AU2009288594A1
公开(公告)日：2010-03-11
申请号：AU2009288594
申请日：2009-07-16
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.
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公开(公告)号：AU2012202551A1
公开(公告)日：2012-05-24
申请号：AU2012202551
申请日：2012-05-01
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless 5 housing without a bezel.
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公开(公告)号：HK1143109A1
公开(公告)日：2010-12-24
申请号：HK10109754
申请日：2010-10-14
Applicant: APPLE INC
Inventor： YEATES KYLE
IPC: B22D20060101 , B22F20060101
Abstract: An integral assembly, comprising: a transparent member having a softening temperature greater than or equal to 2000° F; and a metal member engaging the transparent member to form the integral assembly; wherein the metal member comprises an amorphous alloy and is formed around the transparent member by a metal injection molding (MIM) process.
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Patent Agency Ranking
公开(公告)号：CA2735999C
公开(公告)日：2016-02-02
申请号：CA2735999
申请日：2009-07-16
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seam-less housing without a bezel.
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公开(公告)号：HK1158774A1
公开(公告)日：2012-07-20
申请号：HK11112820
申请日：2011-11-25
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
IPC: G06F20060101
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.
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公开(公告)号：AU2011203145B2
公开(公告)日：2012-02-02
申请号：AU2011203145
申请日：2011-06-28
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.
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公开(公告)号：AU2012202551B2
公开(公告)日：2014-07-10
申请号：AU2012202551
申请日：2012-05-01
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless 5 housing without a bezel.
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公开(公告)号：AU2009288594B2
公开(公告)日：2012-04-05
申请号：AU2009288594
申请日：2009-07-16
Applicant: APPLE INC
Inventor： DABOV TEODOR , LIM HUI LENG , YEATES KYLE , LYNCH STEPHEN BRIAN
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.
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