ELECTRONIC DEVICES WITH OPTICAL FIBER RIBBONS

    公开(公告)号:WO2022164608A1

    公开(公告)日:2022-08-04

    申请号:PCT/US2022/011312

    申请日:2022-01-05

    Applicant: APPLE INC.

    Abstract: A light pipe such as a fiber ribbon may be formed from fibers joined by binder such as extruded binder. The fiber ribbon or other light pipe may have bends. A light source may provide light to an input of a fiber ribbon that is guided by the fiber ribbon to a corresponding output. The output may be located in an interior portion of an electronic device or may be positioned so that light from the output exits the electronic device and illuminates external objects. The light source may have light-emitting devices on a substrate. The light-emitting devices may be vertical cavity surface-emitting laser diodes or other lasers and/or may be light-emitting diodes. Light-emitting devices may be arranged in discrete clusters corresponding to the locations of fiber cores in the fiber ribbon.

    INTEGRATED OPTICAL MODULES WITH ENHANCED RELIABILITY AND INTEGRITY
    2.
    发明申请
    INTEGRATED OPTICAL MODULES WITH ENHANCED RELIABILITY AND INTEGRITY 审中-公开
    具有增强的可靠性和完整性的集成光模块

    公开(公告)号:WO2016195791A1

    公开(公告)日:2016-12-08

    申请号:PCT/US2016/024885

    申请日:2016-03-30

    Applicant: APPLE INC.

    Abstract: An optical module (20) includes a transparent substrate (30) and a refractive optical element (42) mounted on the substrate. A conductive heating trace (60) is deposited on the substrate around the refractive optical element. A temperature sensor (62) senses a temperature of the substrate. Control circuitry (50, 51, 53) is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.

    Abstract translation: 光学模块(20)包括透明基板(30)和安装在基板上的折射光学元件(42)。 导电加热迹线(60)沉积在折射光学元件周围的基底上。 温度传感器(62)感测衬底的温度。 控制电路(50,51,53)耦合到温度传感器,以便测量衬底的温度与模块的目标工作温度之间的差异,并且响应于该温度传感器驱动电流通过导电加热迹线 差异,从而将基板加热到目标工作温度。

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