公开(公告)号：WO2008085930A3

公开(公告)日：2008-07-17

申请号：PCT/US2008/000178

申请日：2008-01-04

Applicant: APPLE INC. ,  WANG, Erik, L. ,  MURPHY, Sean ,  TAN, Tang, Yew ,  NEAVES, Jeffrey, Eugene ,  DAVIS, Lawrence, E. ,  KIM, Sung

Inventor： WANG, Erik, L. ,  MURPHY, Sean ,  TAN, Tang, Yew ,  NEAVES, Jeffrey, Eugene ,  DAVIS, Lawrence, E. ,  KIM, Sung

IPC: H05K5/02

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

公开(公告)号：EP2100488B1

公开(公告)日：2016-09-28

申请号：EP08713019.1

申请日：2008-01-04

Applicant: APPLE INC.

Inventor： WANG, Erik, L. ,  MURPHY, Sean ,  TAN, Tang, Yew ,  NEAVES, Jeffrey, Eugene ,  DAVIS, Lawrence, E. ,  KIM, Sung

IPC: H05K5/02

CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

公开(公告)号：EP2100488A2

公开(公告)日：2009-09-16

申请号：EP08713019.1

申请日：2008-01-04

Applicant: Apple Inc.

Inventor： WANG, Erik, L. ,  MURPHY, Sean ,  TAN, Tang, Yew ,  NEAVES, Jeffrey, Eugene ,  DAVIS, Lawrence, E. ,  KIM, Sung

IPC: H05K5/02

CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

Abstract translation: 电子设备设置有可喷射部件组件16，其可以与设备的壳体18的外表面基本上齐平，尽管其制造变化。 可喷射部件组件可以包括连接到装置的电路板11的连接器40以及可以装载有通过设备的壳体中的开口19插入的可移除模块30的托盘20，并且连接到功能上对准可移除模块 与电路板。 可喷射部件组件还可以包括联接到装置的壳体的喷射器50，用于从连接器喷射托盘，并且因此从装置本身排出托盘。