公开(公告)号：WO2018231657A1

公开(公告)日：2018-12-20

申请号：PCT/US2018/036766

申请日：2018-06-08

Applicant: APPLE INC.

Inventor： HOEN, Storrs, T. ,  SUNSHINE, Daniel, D. ,  ZIMMERMAN, Aidan, N. ,  PODHAJNY, Daniel, A. ,  MAY, Maurice, Philip

IPC: G01L1/14

Abstract: A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric -based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiff eners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.

公开(公告)号：WO2020185523A1

公开(公告)日：2020-09-17

申请号：PCT/US2020/021251

申请日：2020-03-05

Applicant: APPLE INC.

Inventor： CHATHAM, Kyle, L. ,  CREWS, Kathryn, P. ,  GOMES, Didio, V. ,  GRENA, Benjamin, J. ,  HOEN, Storrs, T. ,  KEATING, Steven, J. ,  KINDLON, David, M. ,  PODHAJNY, Daniel, A. ,  ROSENBERG, Andrew, L. ,  SUNSHINE, Daniel, D. ,  UESATO, Lia, M. ,  WALKER, Joseph, B. ,  BINDER, Felix ,  WENDISCH, Bertram ,  LATTA, Martin ,  SCHLÄPFER, Ulrich ,  ROBIN, Franck ,  BAUMANN, Michael ,  FISCHER, Helen, Wächter

IPC: D03J1/00 ,  D03D1/00

Abstract: Interlacing equipment may be used to form fabric (12) and to create a gap (66) in the fabric. The fabric may include one or more conductive strands (80c). An insertion tool (54) may be used to align an electrical component (26) with the conductive strands (80c) during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections (82) may be located in grooves (50) in the electrical component (26). An encapsulation tool may dispense encapsulation material (260) in the grooves (50) to encapsulate the solder connections (82). After the electrical component (26) is electrically connected to the conductive strands (80c), the insertion tool 854) may position and release the electrical component in the gap. A component retention tool (220) may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

公开(公告)号：EP3488208A1

公开(公告)日：2019-05-29

申请号：EP18737077.0

申请日：2018-06-08

Applicant: Apple Inc.

Inventor： HOEN, Storrs, T. ,  SUNSHINE, Daniel, D. ,  ZIMMERMAN, Aidan, N. ,  PODHAJNY, Daniel, A. ,  MAY, Maurice, Philip

IPC: G01L1/14

公开(公告)号：EP2954392A1

公开(公告)日：2015-12-16

申请号：EP14707268.0

申请日：2014-02-06

Applicant: Apple Inc.

Inventor： HARLEY, Jonah, A. ,  HUPPI, Brian, Q. ,  SHAH, Dhaval, N. ,  GRUNTHANER, Martin, P. ,  HOTELLING, Steven, P. ,  CHRISTOPHY, Miguel, C. ,  KATIYAR, Vivek ,  TAN, Tan, Yew ,  BUTLER, Christopher, J. ,  DE JONG, Erik, G. ,  QIAO, Rui ,  MARTISAUSKAS, Steven, J. ,  HOEN, Storrs, T. ,  DINH, Richard, Hung, Minh ,  HOOTON, Lee, E. ,  SPRAGGS, Ian, A. ,  COHEN, Sawyer, I. ,  PAKULA, David, A. ,  RICHARDS, Peter, W. ,  LEUNG, Omar, Sze ,  SARTEE, Ming

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F2203/04105

Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.