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    Structured fabrics for electronic devices
    4.
    发明授权
    Structured fabrics for electronic devices 有权

    公开(公告)号：US10966332B2

    公开(公告)日：2021-03-30

    申请号：US15891533

    申请日：2018-02-08

    Applicant: Apple Inc.

    Inventor： Yohji Hamada ,  John J. Baker ,  Peter F. Coxeter ,  Benjamin M. Rappoport ,  Joseph B. Walker

    IPC: B32B3/26 ,  B32B5/02 ,  H05K5/03 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00

    Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.

    Handsfree beam pattern configuration
    5.
    发明授权
    Handsfree beam pattern configuration 有权

    公开(公告)号：US10251008B2

    公开(公告)日：2019-04-02

    申请号：US15037302

    申请日：2014-09-25

    Applicant: Apple Inc.

    Inventor： John J. Baker ,  Martin E. Johnson ,  Afrooz Family ,  Michael B. Howes ,  Craig M. Stanley ,  Brad G. Boozer

    IPC: H04S7/00 ,  G10L17/04 ,  G10L17/06 ,  H04R1/08 ,  H04R1/40

    Abstract: An audio system that adjusts one or more beam patterns emitted by one or more loudspeaker arrays based on the preferences of users/listeners is described. The audio system includes an audio receiver that contains a listener location estimator, a listener identifier, and a voice command processor. Inputs from the listener location estimator, the listener identifier, and the voice command processor are fed into an array processor. The array processor drives the one or more loudspeaker arrays to emit beam patterns into the listening area based on inputs from each of these devices. By examining the location, preferred usage settings, and voice commands from listeners, the generated beam patterns are customized to the explicit and implicit preferences of the listeners with minimal direct input. Other embodiments are also described.

    Electronic device with array of reworkable components
    8.
    发明授权
    Electronic device with array of reworkable components 有权

    公开(公告)号：US09629272B1

    公开(公告)日：2017-04-18

    申请号：US14720376

    申请日：2015-05-22

    Applicant: Apple Inc.

    Inventor： Phillip Michael Hobson ,  Nathan P. Bosscher ,  John J. Baker ,  Craig M. Stanley ,  Brad G. Boozer

    IPC: H05K7/14 ,  H01R11/11

    CPC classification number: G06F1/1658 ,  G06F1/183

    Abstract: An array of electrical components may be mounted in openings in an electronic device housing. Gaskets may be used to seal the electrical components to a housing wall. The housing wall may be planar or may have a cylindrical shape or other curved shape. The electrical components may be mounted to the housing wall using screws and nuts. Each nut may have a central member with opposing stops at the ends of the central member. An opening in each central member may receive a screw to allow the nut to rotate between an installation position and a locked position. The openings in the housing wall may have scalloped extensions that allow the nuts to clear the housing wall while the components are being inserted into the housing. Following installation, the nuts may be rotated into the locked positions.

    Connection structures for electrical components in an electronic device
    9.
    发明授权
    Connection structures for electrical components in an electronic device 有权
    电子设备中电气部件的连接结构

    公开(公告)号：US09496668B1

    公开(公告)日：2016-11-15

    申请号：US14720059

    申请日：2015-05-22

    Applicant: Apple Inc.

    Inventor： John J. Baker ,  Brad G. Boozer ,  Craig M. Stanley ,  Erik L. Wang ,  Nathan P. Bosscher ,  Phillip Michael Hobson ,  Stephen P. Zadesky

    IPC: H01R13/74 ,  H01R13/73 ,  H01R35/02 ,  H01R13/50 ,  H01R25/00 ,  H01R27/02 ,  H01R13/717 ,  H01R13/66

    CPC classification number: H01R35/02 ,  H01R12/91 ,  H01R13/50 ,  H01R13/665 ,  H01R13/6683 ,  H01R13/717 ,  H01R25/006 ,  H01R27/02

    Abstract: An electronic device may have a rigid support structure to which electrical components are mounted. The rigid support structure may be an electronic device housing structure such as a housing wall having openings that receive the electrical components. The electrical components may have electrical component connectors. A printed circuit board may be used to convey signals for the electrical components. Connectors may be mounted to the printed circuit board. Lateral shift accommodation structures may be formed between the electrical component connectors and the electrical components or in the vicinity of the connectors on the printed circuit to allow the connectors on the printed circuit to mate with the electrical component connectors of the rigidly mounted electrical components.

    Abstract translation: 电子设备可以具有刚性支撑结构，电气部件被安装到该刚性支撑结构上。 刚性支撑结构可以是电子设备壳体结构，例如具有容纳电气部件的开口的壳体壁。 电气部件可以具有电气部件连接器。 印刷电路板可用于传送电气部件的信号。 连接器可以安装到印刷电路板上。 可以在电气部件连接器和电气部件之间或印刷电路上的连接器附近形成侧向移动容纳结构，以允许印刷电路上的连接器与刚性安装的电气部件的电气部件连接器配合。

    Methods for Assembling Electronic Devices With Adhesive
    10.
    发明申请
    Methods for Assembling Electronic Devices With Adhesive 有权
    用粘合剂组装电子设备的方法

    公开(公告)号：US20150282329A1

    公开(公告)日：2015-10-01

    申请号：US14231454

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： John J. Baker

    IPC: H05K3/28 ,  H05K3/30

    CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

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