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公开(公告)号：WO2012118603A1
公开(公告)日：2012-09-07
申请号：PCT/US2012/024332
申请日：2012-02-08
Applicant: APPLE INC. , KENNEY, Kevin M. , RUSSELL-CLARKE, Peter N.
Inventor： KENNEY, Kevin M. , RUSSELL-CLARKE, Peter N.
CPC classification number: B29C70/32 , B29C53/562 , B29C53/564 , B29C53/845 , B29C70/347 , B29L2031/3437 , B29L2031/3481 , H05K5/0008 , Y10T156/1028
Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.
Abstract translation: 提供了一种用于容纳电子设备的复合外壳及其相关方法。 特别地，在一些实施例中，制造用于容纳电子设备的复合外壳的方法包括围绕心轴卷绕复合材料并固化复合材料以形成复合箍。 在单独的工艺中形成板，其包括在模具中堆叠多个复合层并固化复合层以产生复合板。 复合箍和复合板结合在一起形成复合外壳。
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公开(公告)号：WO2016048453A1
公开(公告)日：2016-03-31
申请号：PCT/US2015/043208
申请日：2015-07-31
Applicant: APPLE INC.
Inventor： LOBISSER, G. Kyle , KEATS, Jason S. , MIHELICH, Ryan J. , VIEITES, Pablo Seoane , KENNEY, Kevin M. , RAFF, John , UTTERMANN, Erik A. , KUNA, Melody L. , ROSS, Oliver C.
CPC classification number: H04R1/2888 , H04R1/2834 , H04R2201/029 , H04R2499/11
Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.
Abstract translation: 封闭电子设备外壳。 外壳包括构造成改善结构支撑以防止损坏并消散整个外壳的振动的肋结构。 肋结构可以接收扬声器模块和盖构件。 肋结构和扬声器模块可以组合形成三维体积，从而允许扬声器模块可以投影声音的扬声器模块，从而增强声学性能。 此外，盖构件可以粘合地附接到肋结构，以提供抵抗由与落下事件相关联的负载力引起的振动和滥用的附加结构支撑。
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公开(公告)号：EP2665596B1
公开(公告)日：2016-05-18
申请号：EP12704216.6
申请日：2012-02-08
Applicant: Apple Inc.
Inventor： KENNEY, Kevin M. , RUSSELL-CLARKE, Peter N.
CPC classification number: B29C70/32 , B29C53/562 , B29C53/564 , B29C53/845 , B29C70/347 , B29L2031/3437 , B29L2031/3481 , H05K5/0008 , Y10T156/1028
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公开(公告)号：EP2665596A1
公开(公告)日：2013-11-27
申请号：EP12704216.6
申请日：2012-02-08
Applicant: Apple Inc.
Inventor： KENNEY, Kevin M. , RUSSELL-CLARKE, Peter N.
CPC classification number: B29C70/32 , B29C53/562 , B29C53/564 , B29C53/845 , B29C70/347 , B29L2031/3437 , B29L2031/3481 , H05K5/0008 , Y10T156/1028
Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.
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