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公开(公告)号:WO2015160744A3
公开(公告)日:2015-10-22
申请号:PCT/US2015/025661
申请日:2015-04-14
Applicant: APPLE INC.
Inventor: TZIVISKOS, George , LEE, Jae Hwang , AMINI, Mahmoud R. , HACK, Paul J. , GAO, Zheng , ZHOU, Rui
IPC: H01R13/6585 , H01R24/60 , H01R13/504 , H01R12/71 , H01R13/6594
Abstract: Connector receptacles that are able to withstand insertion and other forces, are reliable, and are easy to manufacture. In various examples, the connector receptacle tongue or other portions may be reinforced such that they may withstand the insertion forces exerted through a connector insert.
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公开(公告)号:WO2021062278A1
公开(公告)日:2021-04-01
申请号:PCT/US2020/052886
申请日:2020-09-25
Applicant: APPLE INC.
Inventor: CHALMERS, Devin William , LEE, Jae Hwang , NAIR, Rahul , NEGOITA, Ioana
Abstract: An exemplary process for providing an extended reality experience includes receiving a request to present a virtual representation of a remote participant of a communication session. In response to receiving the request to present the virtual representation of the remote participant, an electronic device is determined to be at a first location in a physical environment, and the virtual representation of the remote participant is displayed such that the virtual representation appears to be located at a second location in the physical environment. The second location is different from the first location and a first coordinate of the second location is determined using a first coordinate of the first location.
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公开(公告)号:WO2019050782A1
公开(公告)日:2019-03-14
申请号:PCT/US2018/049000
申请日:2018-08-31
Applicant: APPLE INC.
Inventor: SELVAKUMAR, Sivesh , CAMPO, Laura M. , CHANG, Timothy Y. , ROTHKOPF, Fletcher R. , LEE, Jae Hwang , GERHARD, Holly, E.
Abstract: A head-mounted display to be worn by a user includes a housing, a component chamber defined in the housing, and electronic components that generate heat. The electronic components are located in the component chamber of the housing. The head-mounted display also includes a first fan for causing air to flow through the component chamber.
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公开(公告)号:EP3646684A1
公开(公告)日:2020-05-06
申请号:EP18773041.1
申请日:2018-08-31
Applicant: Apple Inc.
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