公开(公告)号：WO2013119471A1

公开(公告)日：2013-08-15

申请号：PCT/US2013/024443

申请日：2013-02-01

Applicant: APPLE INC.

Inventor： ARNOLD, Shawn X. ,  KIDD, Douglas P. ,  MAYO, Sean A. ,  MULLINS, Scott P. ,  PYPER, Dennis R. ,  THOMA, Jeffrey M. ,  KENYU, Tojima

IPC: H01G4/30 ,  H01L23/12 ,  H05K3/46

CPC classification number: G06F1/183 ,  H01L2224/16227 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/181 ,  H05K1/185 ,  H05K3/403 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02P70/611 ,  Y10T29/4913

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract translation: 公开了堆叠的组件阵列。 在一个实施例中，第一和第二层组件通过电介质和机械耦合到具有设置在第一层和第二层之间的被封装的第三层组件的中介层。 第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。 插入器可以在第一层和第二层之间的组件之间耦合信号。

公开(公告)号：WO2015027239A3

公开(公告)日：2015-02-26

申请号：PCT/US2014/052538

申请日：2014-08-25

Applicant: APPLE INC.

Inventor： AMINI, Mahmoud R. ,  GAO, Zheng ,  PYPER, Dennis R.

IPC: H01R13/66 ,  H01R24/60 ,  B23C3/12 ,  H05K3/10 ,  H05K3/24 ,  H01R13/6473

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.