公开(公告)号：EP2546730A3

公开(公告)日：2014-05-07

申请号：EP12176155.5

申请日：2012-07-12

Applicant: Apple Inc.

Inventor： Grunthaner, Martin Paul ,  Rothkopf, Fletcher R. ,  Mullens, Christopher Tenzin ,  Hotelling, Steven Porter ,  O'Connor, Sean Erik

IPC: G06F3/041 ,  H03K17/955 ,  H03K17/96 ,  H03K17/975

Abstract: Combined force and proximity sensing is disclosed. One or more sensors can concurrently sense a force applied by an object on a device surface and a proximity of the object to the surface. In an example, a single sensor can sense both force and proximity via a resistance change and a capacitance change, respectively, at the sensor. In another example, multiple sensors can be used, where one sensor can sense force via either a resistance change or a capacitance change and another sensor can sense proximity via a capacitance change.

公开(公告)号：EP2728680A1

公开(公告)日：2014-05-07

申请号：EP14152776.2

申请日：2011-05-27

Applicant: APPLE INC.

Inventor： Golko, Albert J. ,  Schmidt, Mathias W. ,  Spraggs, Ian ,  Frazier, Cameron ,  Jol, Eric S. ,  Minoo, Jahan ,  Rothkopf, Fletcher R. ,  Aase, Jonathan ,  Sander, Wendell B. ,  Terlizzi, Jeffrey J.

IPC: H01R29/00 ,  H01R13/516 ,  H01R13/648 ,  H01R24/60 ,  H01R13/627 ,  H01R13/642 ,  H01R107/00

CPC classification number: H01R13/6273 ,  H01R13/516 ,  H01R13/58 ,  H01R13/62 ,  H01R13/642 ,  H01R13/6485 ,  H01R13/658 ,  H01R24/58 ,  H01R24/60 ,  H01R29/00 ,  H01R2107/00 ,  H01R2201/06 ,  H05K9/0007

Abstract: A dual orientation plug connector comprising a body; a connector tab extending away from the body, the tab is covered by a rectangular-tube shaped conductive frame having first and second opposing sides, and third and fourth opposing sides both orthogonal to first and second sides. The first and second side respectively including a first and second openings facing each other; a first plurality of external contacts carried by a substrate in a first contact region formed in the first opening of the frame; and a second plurality of external contacts carried by a substrate in a second contact region formed in the second opening of the frame, wherein each contact in the second plurality of contacts is positioned directly opposite a contact in the first plurality of contacts. Dielectric material separates each of the first and second plurality of contacts from adjacent contacts and from the frame.

Abstract translation: 一种双向插头连接器，包括主体; 一个远离主体延伸的连接器接头，突出部分被具有第一和第二相对侧面的矩形管状导电框架以及与第一和第二侧正交的第三和第四相对侧面覆盖。 第一和第二侧分别包括彼此面对的第一和第二开口; 由形成在所述框架的第一开口中的第一接触区域中的基板承载的第一多个外部接触件; 以及由形成在所述框架的第二开口中的第二接触区域中的基板承载的第二多个外部接触件，其中所述第二多个触头中的每个触点与所述第一多个触点中的触点直接相对定位。 电介质材料将第一和第二多个触点中的每一个与相邻的触点和框架分开。

公开(公告)号：EP2546730B1

公开(公告)日：2020-04-01

申请号：EP12176155.5

申请日：2012-07-12

Applicant: Apple Inc.

Inventor： Grunthaner, Martin Paul ,  Rothkopf, Fletcher R. ,  Mullens, Christopher Tenzin ,  Hotelling, Steven Porter ,  O'Connor, Sean Erik

IPC: G06F3/041 ,  H03K17/955 ,  H03K17/96 ,  H03K17/975

公开(公告)号：EP2424034A1

公开(公告)日：2012-02-29

申请号：EP11177876.7

申请日：2011-08-17

Applicant: Apple Inc.

Inventor： Li, Qingxiang ,  Schlub, Robert W. ,  Rothkopf, Fletcher R. ,  Mittleman, Adam D. ,  Jiang, Yi ,  McMilin, Emily ,  Zhang, Li-jun

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

Abstract translation: 提供了包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括诸如倒F天线的天线，其包含天线谐振元件和天线接地元件。 天线谐振元件可以由诸如柔性电路基板的基板上的图案化导电迹线形成。 天线接地元件可以由诸如金属外壳壁的导电器件结构形成。 诸如电介质支撑构件和泡沫层的支撑和偏置结构可用于支撑天线共振元件并将其偏压抵抗平面装置结构。 天线谐振元件偏置的平面器件结构可以是平面电介质构件，例如显示器盖玻璃或其它平面结构的透明层。 粘合剂可以介于平面结构和天线谐振元件之间。

公开(公告)号：EP2424034B1

公开(公告)日：2016-11-16

申请号：EP11177876.7

申请日：2011-08-17

Applicant: Apple Inc.

Inventor： Li, Qingxiang ,  Schlub, Robert W. ,  Rothkopf, Fletcher R. ,  Mittleman, Adam D. ,  Jiang, Yi ,  McMilin, Emily ,  Zhang, Li-jun

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

公开(公告)号：EP2728680B1

公开(公告)日：2016-04-20

申请号：EP14152776.2

申请日：2011-05-27

Applicant: APPLE INC.

Inventor： Golko, Albert J. ,  Schmidt, Mathias W. ,  Spraggs, Ian ,  Frazier, Cameron ,  Jol, Eric S. ,  Minoo, Jahan ,  Rothkopf, Fletcher R. ,  Aase, Jonathan ,  Sander, Wendell B. ,  Terlizzi, Jeffrey J.

IPC: H01R29/00 ,  H01R13/516 ,  H01R13/648 ,  H01R24/60 ,  H01R13/627 ,  H01R13/642 ,  H01R107/00

CPC classification number: H01R13/6273 ,  H01R13/516 ,  H01R13/58 ,  H01R13/62 ,  H01R13/642 ,  H01R13/6485 ,  H01R13/658 ,  H01R24/58 ,  H01R24/60 ,  H01R29/00 ,  H01R2107/00 ,  H01R2201/06 ,  H05K9/0007

Abstract: A dual orientation plug connector comprising a body; a connector tab extending away from the body, the tab is covered by a rectangular-tube shaped conductive frame having first and second opposing sides, and third and fourth opposing sides both orthogonal to first and second sides. The first and second side respectively including a first and second openings facing each other; a first plurality of external contacts carried by a substrate in a first contact region formed in the first opening of the frame; and a second plurality of external contacts carried by a substrate in a second contact region formed in the second opening of the frame, wherein each contact in the second plurality of contacts is positioned directly opposite a contact in the first plurality of contacts. Dielectric material separates each of the first and second plurality of contacts from adjacent contacts and from the frame.

公开(公告)号：EP2546730A2

公开(公告)日：2013-01-16

申请号：EP12176155.5

申请日：2012-07-12

Applicant: Apple Inc.

Inventor： Grunthaner, Martin Paul ,  Rothkopf, Fletcher R. ,  Mullens, Christopher Tenzin ,  Hotelling, Steven Porter ,  O'Connor, Sean Erik

IPC: G06F3/041

Abstract: Combined force and proximity sensing is disclosed. One or more sensors can concurrently sense a force applied by an object on a device surface and a proximity of the object to the surface. In an example, a single sensor can sense both force and proximity via a resistance change and a capacitance change, respectively, at the sensor. In another example, multiple sensors can be used, where one sensor can sense force via either a resistance change or a capacitance change and another sensor can sense proximity via a capacitance change.

Abstract translation: 公开了组合力和接近感测。 一个或多个传感器可以同时感测由物体在设备表面上施加的力和物体与表面的接近度。 在一个示例中，单个传感器可以分别通过传感器处的电阻变化和电容变化来感测力和接近度。 在另一个示例中，可以使用多个传感器，其中一个传感器可以通过电阻变化或电容变化感测力，而另一个传感器可以通过电容变化来感测接近。