Abstract:
A method of creating a resistive pathway for an electronic assembly is disclosed. In one embodiment, the pathway can be formed with a resistive film in conjunction with a conductive adhesive and a coverlay. In another embodiment, the resistive film, the conductive adhesive and the coverlay can be relatively transparent. In yet another embodiment, the resistive pathway can couple directly with traces on an electronic assembly saving space and easing assembly.
Abstract:
A charge pump that can be configured to operate in a first mode and a second mode is disclosed. The charge pump can comprise a charging capacitor coupled to a first node and configured to transfer a first DC voltage to the first node. The charge pump can also comprise a first output node and a second output node coupled to the first node. During the first mode, the first output node can be configured to output a second DC voltage based on the first DC voltage, and the second output node can be configured to output a third DC voltage based on the first DC voltage. During the second mode, the first output node can be configured to output the second DC voltage, and the second output node can be configured to output an AC voltage, the AC voltage being offset by the third DC voltage.