Abstract:
An electronic device 10 may be provided with an organic light- emitting diode display 14 with minimized border regions IA. The border regions IA may be minimized by providing the display with bent edge portions 56 having neutral plane adjustment features 58 that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer 52 of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.
Abstract:
An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing conductive structures (microvia 73) that pass through polymer layers (48, 52) of the display and/or conductive structures that wrap around an edge of the display and couple conductive traces (51) on the display to conductive traces (59) on additional circuitry (flexible printed circuit 62) that is mounted behind the display.
Abstract:
Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.
Abstract:
A lamination system (110) may be provided for attaching together display layers (45,46) for an electronic device display. The system may include one or more pressure- sensing lamination stages (124, 126) for temporarily mounting the display layers during lamination operations. A pressure- sensing lamination stage (124) may include one or more pressure sensors (130) configured to sense pressures that are applied to the display layers during lamination operations. The pressure-sensing lamination stages may include a fixed mounting stage (126) and a movable mounting stage (124). The movable mounting stage may be moved so that a first set of display layers is pressed against a second set of display layers to attach the first and second sets of display layers. The pressure with which the first set of display layers (45;46) is pressed against the second set of display layers may be adjusted based on pressure data gathered using the pressure sensors (130).
Abstract:
An assembly system may be provided for attaching together display layers for an electronic device display. The system may include substrate cleaning equipment that includes one or more pressure- sensing cleaning rollers (124) for removing debris from the display layers during assembly operations. A pressure-sensing cleaning roller (124) may include a cylindrical roller member having a tacky surface and one or more pressure sensors (136) configured to sense pressures that are applied to the display layers during cleaning operations. The position and orientation of the cleaning rollers (124) may be adjusted before or during cleaning operations based on pressure data gathered using the pressure sensors. The pressure sensors (136) may be attached to the tacky surface of the cylindrical roller member, attached to an edge of the roller member, embedded within the roller member, or attached to other equipment that moves with the roller member.
Abstract:
An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing conductive structures (microvia 73) that pass through polymer layers (48, 52) of the display and/or conductive structures that wrap around an edge of the display and couple conductive traces (51) on the display to conductive traces (59) on additional circuitry (flexible printed circuit 62) that is mounted behind the display.
Abstract:
Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.
Abstract:
An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The display includes a first polymer layer 48, a layer of organic emissive material 46 on the first polymer layer, an encapsulation layer 50 formed over the layer of organic emissive material and a second polymer layer 52 attached to the first polymer layer. The border regions may be minimized by providing conductive structures (microvias 73) that pass through polymer layers 48, 52 of the display and couple conductive traces 51 on the display to conductive traces 59 on additional circuitry 62 that is mounted behind the display.
Abstract:
Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.