公开(公告)号：USD837755S1

公开(公告)日：2019-01-08

申请号：US29618506

申请日：2017-09-21

Applicant: APPLIED MATERIALS, INC.

Designer： Martin Lee Riker ,  Fuhong Zhang ,  Yu Liu

公开(公告)号：USD801942S1

公开(公告)日：2017-11-07

申请号：US29524109

申请日：2015-04-16

Applicant: APPLIED MATERIALS, INC.

Designer： Martin Lee Riker ,  Fuhong Zhang ,  Yu Liu

公开(公告)号：US10283334B2

公开(公告)日：2019-05-07

申请号：US14522066

申请日：2014-10-23

Applicant: APPLIED MATERIALS, INC.

Inventor： William Johanson ,  Fuhong Zhang ,  Adolph Miller Allen ,  Yu Liu

IPC: C23C14/34 ,  H01J37/34 ,  C23C14/54 ,  H01J37/32 ,  C23C14/50

Abstract: Embodiments of improved methods and apparatus for maintaining low non-uniformity over the course of the life of a target are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition chamber includes: disposing a substrate atop a substrate support having a cover ring that surrounds the substrate support such that an upper surface of the substrate is positioned at a first distance above an upper surface of the cover ring; sputtering a source material from a target disposed opposite the substrate support to deposit a film atop the substrate while maintaining the first distance; and lowering the substrate support with respect to the cover ring and sputtering the source material from the target to deposit films atop subsequent substrates over a life of the target.

公开(公告)号：USD825504S1

公开(公告)日：2018-08-14

申请号：US29610166

申请日：2017-07-10

Applicant: APPLIED MATERIALS, INC.

Designer： Fuhong Zhang ,  William Johanson ,  Yu Liu ,  Adolph Miller Allen ,  Brij Datta ,  Keith A. Miller

公开(公告)号：USD797067S1

公开(公告)日：2017-09-12

申请号：US29524557

申请日：2015-04-21

Applicant: APPLIED MATERIALS, INC.

Designer： Fuhong Zhang ,  William Johanson ,  Yu Liu ,  Adolph Miller Allen ,  Brij Datta ,  Keith A. Miller