-
公开(公告)号:NO985619D0
公开(公告)日:1998-12-02
申请号:NO985619
申请日:1998-12-02
Applicant: ASAHI CHEMICAL IND
Inventor: KODAMA TAMOTSU , MINOURA HARUYUKI , MIYAKE NOBUHISA , YAMAMATSU SETSUO , KATSUMATA TSUTOMU
IPC: C07D487/18 , C07D487/22 , C07D
Abstract: Disclosed is a method for producing an acyl group-containing hexaazaisowurtzitane derivative represented by the following formula (1), WAnH(6-n) wherein n represents an integer of 4 or 6, each A independently represents an acyl group having 1 to 10 carbon atoms, H represents a hydrogen atom, and W represents a hexavalent hexaazaisowurtzitane residue represented by the following formula (2): which comprises: providing a composition system comprising a mixed solvent of a first solvent and a second solvent respectively having high and low dissolving abilities for the desired compound, wherein the mixed solvent has the desired compound dissolved therein; and removing the first solvent having a high dissolving ability from the composition system to thereby deposit crystals of the desired compound. The desired compound, which is useful as a precursor of high performance explosive additive, i.e., hexanitrohexaazaisowurtzitane, can be easily produced in high purity form in high yield and at low cost.
-
公开(公告)号:DE69131337T2
公开(公告)日:2000-02-03
申请号:DE69131337
申请日:1991-02-22
Applicant: ASAHI CHEMICAL IND
Inventor: YOKOYAMA AKINORI , KATSUMATA TSUTOMU , NAKAJIMA HITOSHI
IPC: H01B1/02 , B22F1/00 , C09D5/24 , C09J9/00 , C09J9/02 , C09J11/04 , C22C1/04 , C22C5/06 , C22C5/08 , C22C9/00 , H01B1/22 , H01C7/00 , H05K1/09 , H05K3/40 , H05K9/00
Abstract: A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001
-
公开(公告)号:DE69131337D1
公开(公告)日:1999-07-22
申请号:DE69131337
申请日:1991-02-22
Applicant: ASAHI CHEMICAL IND
Inventor: YOKOYAMA AKINORI , KATSUMATA TSUTOMU , NAKAJIMA HITOSHI
IPC: H01B1/02 , B22F1/00 , C09D5/24 , C09J9/00 , C09J9/02 , C09J11/04 , C22C1/04 , C22C5/06 , C22C5/08 , C22C9/00 , H01B1/22 , H01C7/00 , H05K1/09 , H05K3/40 , H05K9/00
Abstract: A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001
-
公开(公告)号:CA2260092A1
公开(公告)日:1998-04-23
申请号:CA2260092
申请日:1997-10-14
Applicant: ASAHI CHEMICAL IND
Inventor: KODAMA TAMOTSU , MINOURA HARUYUKI , KATSUMATA TSUTOMU , YAMAMATSU SETSUO , MIYAKE NOBUHISA
IPC: C07D487/18 , C07D487/22
Abstract: A process for preparing acylated hexaazaisowurtzitane derivatives represented by general formula (1): WAnH(6-n), wherein n is 4 or 6; As are each independently C1-C10 acyl; H is hydrogen; and W is a hexavalent hexaazaisowurtzitane residue of formula (2), by preparing a composition comprising a mixed solvent comprising a first solvent exhibiting high solvency for one of the derivatives and a second solvent exhibiting low solvency for the derivative and the derivative dissolved in the mixed solvent, and removing the first solvent from the composition to crystallize the derivative. This process makes it possible to prepare the above derivatives at a high purity, in a high yield and at a low cost, the derivatives being useful as precursors for hexanitrohexaazaisowurtzitane which is an additive for high explosives.
-
公开(公告)号:DE19681298T1
公开(公告)日:1998-04-02
申请号:DE19681298
申请日:1996-03-06
Applicant: ASAHI CHEMICAL IND
Inventor: UEDA EIJII , KASAHARA HIDEO , MATSUBARA KAZUHIRO , KATSUMATA TSUTOMU
IPC: C07F9/12 , C08K5/52 , C08K5/523 , C08K5/521 , C08K13/02 , C08L25/06 , C08L69/00 , C08L71/10 , C08L29/00 , C08L21/00 , C08L27/18 , C09K21/14 , C09K21/04
Abstract: PCT No. PCT/JP96/00535 Sec. 371 Date Sep. 5, 1997 Sec. 102(e) Date Sep. 5, 1997 PCT Filed Mar. 6, 1996 PCT Pub. No. WO96/27600 PCT Pub. Date Sep. 12, 1996The present invention provides a flame-retardant resin composition which comprises 100 parts by weight of a thermoplastic resin (A) and 0.1 to 30 parts by weight of one or more of organic phosphorus compounds (B) represented by the following formula (1) wherein X is R1, R2, R3 and R4 independently represent a phenyl group or a xylyl group with at least one being a phenyl group and at least one being a xylyl group, and n is a positive integer. The flame-retardant resin composition of the present invention is excellent in heat resistance, impact strength in the form of thin-walled moldings and blooming-free property on the surface of articles molded therefrom.
-
6.
公开(公告)号:DE3261712D1
公开(公告)日:1985-02-07
申请号:DE3261712
申请日:1982-10-18
Applicant: ASAHI CHEMICAL IND
Inventor: AOKI KUNITOSHI , HONDA MAKOTO , DOZONO TETSURO , KATSUMATA TSUTOMU
IPC: B01J23/88 , B01J23/881 , B01J27/18 , B01J27/185 , B01J27/192 , C07B61/00 , C07C1/00 , C07C5/48 , C07C11/12 , C07C11/167 , C07C45/00 , C07C45/34 , C07C45/35 , C07C45/37 , C07C45/39 , C07C47/22 , C07C67/00 , C07C253/00 , C07C255/08 , C07C120/14
Abstract: The catalyst composition has a composition represented by the formula:… A0.1 B0.02-1 Mo12 Bi0.5-10 Fe0.5-10 Na0-3 P0-2 Og… wherein A is at least one element selected from cerium, lanthanum, neodymium, praseodymium, samarium, europium, and gadolinium, B is at least one element selected from potassium, rubidium and caesium, and g is the number of oxygen atoms required to satisfy the valence requirements of the other elements present, and is supported on silica. The catalyst composition is used in the production of acrolein, methacrolein, 1,3-butadiene, acrylonitrile or methacrylonitrile by the oxidation or ammoxidation of propylene, isobutylene, tert-butanol or 1-butene.
-
公开(公告)号:AT181452T
公开(公告)日:1999-07-15
申请号:AT91904341
申请日:1991-02-22
Applicant: ASAHI CHEMICAL IND
Inventor: YOKOYAMA AKINORI , KATSUMATA TSUTOMU , NAKAJIMA HITOSHI
IPC: H01B1/02 , B22F1/00 , C09D5/24 , C09J9/00 , C09J9/02 , C09J11/04 , C22C1/04 , C22C5/06 , C22C5/08 , C22C9/00 , H01B1/22 , H01C7/00 , H05K1/09 , H05K3/40 , H05K9/00
Abstract: A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001
-
公开(公告)号:HK1004871A1
公开(公告)日:1998-12-11
申请号:HK98103560
申请日:1998-04-28
Applicant: ASAHI CHEMICAL IND
Inventor: YOKOYAMA AKINORI , KATSUMATA TSUTOMU , NAKAJIMA HITOSHI
IPC: H01B1/22 , B22F1/02 , C22C32/00 , H01B1/02 , H01B1/16 , H01C17/28 , H01G4/008 , H05K1/09 , H05K9/00 , H01B , B22F , C22C , H01K , H05K
Abstract: An inexpensive conductive composition having high electric conductivity, high oxidation resistance, high migration resistance, excellent solder wettability and high resistance to corrosion due to the action of solder and long shelf life. The conductive composition is expressed by the general formula AgxCuyMz (where M is at least one metal selected from the group consisting of Bi, Pb and Zn; and x, y and z represent an atomic ratio, and satisfy the relation x+y+z = 1, 0.001
-
公开(公告)号:AU4473197A
公开(公告)日:1998-05-11
申请号:AU4473197
申请日:1997-10-14
Applicant: ASAHI CHEMICAL IND
Inventor: KODAMA TAMOTSU , MINOURA HARUYUKI , MIYAKE NOBUHISA , YAMAMATSU SETSUO , KATSUMATA TSUTOMU
IPC: C07D487/18 , C07D487/22
Abstract: Disclosed is a method for producing an acyl group-containing hexaazaisowurtzitane derivative represented by the following formula (1), WAnH(6-n) wherein n represents an integer of 4 or 6, each A independently represents an acyl group having 1 to 10 carbon atoms, H represents a hydrogen atom, and W represents a hexavalent hexaazaisowurtzitane residue represented by the following formula (2): which comprises: providing a composition system comprising a mixed solvent of a first solvent and a second solvent respectively having high and low dissolving abilities for the desired compound, wherein the mixed solvent has the desired compound dissolved therein; and removing the first solvent having a high dissolving ability from the composition system to thereby deposit crystals of the desired compound. The desired compound, which is useful as a precursor of high performance explosive additive, i.e., hexanitrohexaazaisowurtzitane, can be easily produced in high purity form in high yield and at low cost.
-
公开(公告)号:CA2055473C
公开(公告)日:1995-11-14
申请号:CA2055473
申请日:1991-02-22
Applicant: ASAHI CHEMICAL IND
Inventor: YOKOYAMA AKINORI , KATSUMATA TSUTOMU , NAKAJIMA HITOSHI
IPC: H01B1/02 , B22F1/00 , C09D5/24 , C09J9/00 , C09J9/02 , C09J11/04 , C22C1/04 , C22C5/06 , C22C5/08 , C22C9/00 , H01B1/22 , H01C7/00 , H05K1/09 , H05K3/40 , H05K9/00 , H05K3/12
Abstract: A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula AgxCuy (wherein x and y are atomic ratio values; 0.001 ? x ? 0.999, 0.001 ? y ? 0.999, x + y = 1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.
-
-
-
-
-
-
-
-
-