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1.发明申请
公开(公告)号：WO2023086461A1
公开(公告)日：2023-05-19
申请号：PCT/US2022/049531
申请日：2022-11-10
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor： RAY, Jacob G. , RAMAKRISHNAN, Ramesh
Abstract: A polyamide composition comprising a base polyamide and an elastomer concentrate comprising: 20-80 wt% of an elastomeric aliphatic polyether having a molecular weight ranging from 400-4000 g/mol; and 80-20 wt% of a concentrate polyamide. The polyamide composition has particular uses as a cable tie and demonstrates improved cold-temperature applications while maintaining high strength, good flammability rating, and excellent processability.
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公开(公告)号：WO2021226007A1
公开(公告)日：2021-11-11
申请号：PCT/US2021/030546
申请日：2021-05-04
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor： RAY, Jacob G. , RAMAKRISHNAN, Ramesh , HOFFMAN, Douglas Claire , PLANETA, Roland M.
IPC: C08J5/18
Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.
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公开(公告)号：WO2022036189A1
公开(公告)日：2022-02-17
申请号：PCT/US2021/045897
申请日：2021-08-13
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor： RAY, Jacob G. , SPARKS, Bradley J. , RAMAKRISHNAN, Ramesh , SOMASIRI, Nanayakkara L.
Abstract: A polyamide composition comprising from 45 wt% to 95 wt% of polyamide polymer and from 5 wt% to 55 wt% of a modifier comprising a C18-44 dimer acid or a C18-44 dimer amine or a combination thereof. A number average molecular weight of the polyamide polymer is less than 30,000 g/mol. The polyamide composition has a chemical resistance, as measured by exposure to HCl (10%) for 14 days at 58 C, resulting in a weight loss of less than 3.0 wt%; and a moisture uptake of less than about 2.0 wt% moisture at 95% RH. A process for preparing the polyamide composition is also disclosed.
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Patent Agency Ranking
公开(公告)号：WO2023087013A1
公开(公告)日：2023-05-19
申请号：PCT/US2022/079850
申请日：2022-11-15
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor： RAMAKRISHNAN, Ramesh , RAY, Jacob G. , SURIANO, Joseph
Abstract: An antimicrobial film comprising antimicrobial film comprising from 50 wt% to 99.99 wt% of a polyamide composition, and from 10 wppm to 6000 wppm of zinc (and/or copper) dispersed within the film; wherein the film demonstrates: an antimicrobial efficacy to Staphylococcus aureus and Escherichia coli log reduction greater than 2.0, as determined by ISO 22196 (modified), and a slow rate puncture resistance greater than 1.5 N/µm as measured according to ASTM F1306.
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公开(公告)号：EP4146728A1
公开(公告)日：2023-03-15
申请号：EP21731010.1
申请日：2021-05-04
Applicant: Ascend Performance Materials Operations LLC
Inventor： RAY, Jacob G. , RAMAKRISHNAN, Ramesh , HOFFMAN, Douglas Claire , PLANETA, Roland M.
IPC: C08J5/18
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公开(公告)号：EP4196338A1
公开(公告)日：2023-06-21
申请号：EP21773916.8
申请日：2021-08-13
Applicant: Ascend Performance Materials Operations LLC
Inventor： RAY, Jacob G. , SPARKS, Bradley J. , RAMAKRISHNAN, Ramesh , SOMASIRI, Nanayakkara L.
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公开(公告)号：EP4522677A1
公开(公告)日：2025-03-19
申请号：EP23729630.6
申请日：2023-05-10
Applicant: Ascend Performance Materials Operations LLC
Inventor： RAY, Jacob G. , RAMAKRISHNAN, Ramesh
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8.发明公开
公开(公告)号：EP4430104A1
公开(公告)日：2024-09-18
申请号：EP22839524.0
申请日：2022-11-10
Applicant: Ascend Performance Materials Operations LLC
Inventor： RAY, Jacob G. , RAMAKRISHNAN, Ramesh
CPC classification number: C08L77/02 , C08L77/06 , C08G69/40 , C08L2205/02520130101
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