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    SUBSTRATE HOLDER
    1.
    发明申请
    SUBSTRATE HOLDER 审中-公开
    基板支架

    公开(公告)号：WO2005043613A1

    公开(公告)日：2005-05-12

    申请号：PCT/US2004/035665

    申请日：2004-10-27

    Applicant: ASM AMERICA, INC. ,  KEETON, Tony, J. ,  GOODMAN, Matthew, G. ,  STAMP, Michael, R.

    Inventor： KEETON, Tony, J. ,  GOODMAN, Matthew, G. ,  STAMP, Michael, R.

    IPC: H01L21/68

    CPC classification number: H01L21/68735 ,  C23C16/4585 ,  H01L21/6833

    Abstract: A substrate holder for processing a semiconductor substrate that minimizes substrate non-uniformities as well as backside damage. The substrate holder includes one or more support elements, such as a plurality of veins configured in an annular ring to support an outer edge of a substrate. The veins are configured to support a substrate of a particular size in a support plane defined by the top surfaces of the veins. The substrate holder also has one or more annular grooves formed in the top surface of the holder. In a preferred embodiment, the substrate holder also has a raised annular ring positioned radially inward of the grooves and the support elements. The top surface of the raised annular ring is no higher that the top surfaces of the veins.

    Abstract translation: 一种用于处理半导体衬底的衬底保持器，其使衬底不均匀性以及背面损坏最小化。 衬底保持器包括一个或多个支撑元件，例如构造成环形环中的多个静脉，以支撑衬底的外边缘。 静脉构造成在由静脉的顶部表面限定的支撑平面中支撑特定尺寸的基底。 衬底保持器还具有形成在保持器的顶表面中的一个或多个环形槽。 在优选实施例中，衬底保持器还具有位于凹槽和支撑元件的径向内侧的凸起环形环。 凸起环形圈的顶面不大于静脉的顶面。

    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE
    2.
    发明申请
    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE 审中-公开
    SUSCEPTOR POCKET PROFILE提高过程性能

    公开(公告)号：WO2002065510A1

    公开(公告)日：2002-08-22

    申请号：PCT/US2001/048196

    申请日：2001-12-11

    Applicant: ASM AMERICA, INC.

    Inventor： GOODMAN, Matthew, G.

    IPC: H01L21/00

    CPC classification number: H01L21/68735 ,  C23C16/4581 ,  C23C16/4584 ,  H01L21/6875

    Abstract: An apparatus and method to position a wafer (16) onto a wafer holder (200) and to maintain a uniform wafer temperature is disclosed. The wafer holder or susceptor (200) comprises a recess or pocket (202) whose surface (229) is concave and includes a grid containing a plurality of grid grooves (222) separating protrusions (220). The concavity and grid grooves define an enclosed flow volume (248) between a supported wafer (16) and the susceptor surface, as well as an escape area, or total cross-sectional area of the grid grooves (222) opening out from under the periphery of the wafer (16). These are chosen to reduce the wafer slide and curl during wafer drop-off and wafer stick during wafer pick-up, while improving thermal uniformity and reducing particle problems. In another embodiment, centering locators (250 or 252) in the form of thin, radially placed protrusions are provided around the edge of a susceptor pocket (202) to reduce further the possibility of contact between the wafer and the outer shoulder (206) of the susceptor. These features help to achieve temperature uniformity, and therefore quality of the process result, across the wafer during processing.

    Abstract translation: 公开了一种将晶片（16）定位在晶片保持器（200）上并保持均匀晶片温度的装置和方法。 晶片保持器或基座（200）包括其表面（229）是凹形的并包括分隔突起（220）的多个格栅（222）的网格的凹槽（202）。 凹槽和格栅槽限定了支撑晶片（16）和基座表面之间的封闭流体积（248），以及从下面开口的网格槽（222）的逸出区域或总横截面面积 晶片（16）的周边。 这些选择用于在晶片吸收期间在晶片脱落和晶片棒期间减少晶片滑动和卷曲，同时提高热均匀性并减少颗粒问题。 在另一个实施例中，围绕基座凹部（202）的边缘设置呈薄的放射状放置形式的定心定位器（250或252），以进一步减小晶片与外肩部（206）之间的接触的可能性 感受器。 这些特征有助于在加工过程中在晶片上实现温度均匀性，从而达到加工效果的质量。

    SUBSTRATE HOLDER WITH VARYING DENSITY
    4.
    发明申请
    SUBSTRATE HOLDER WITH VARYING DENSITY 审中-公开
    具有不同密度的基座

    公开(公告)号：WO2010053648A2

    公开(公告)日：2010-05-14

    申请号：PCT/US2009/059497

    申请日：2009-10-05

    Applicant: ASM AMERICA, INC.

    Inventor： GIVENS, Michael ,  HALPIN, Mike ,  GOODMAN, Matthew, G. ,  KOSCO, Keir

    IPC: H01L21/683 ,  H01L21/687 ,  H01L21/205

    CPC classification number: H01L21/68735 ,  H01L21/67103 ,  H01L21/67115 ,  H01L21/68785

    Abstract: A substrate support system comprises a substrate holder for supporting a substrate. The substrate holder comprises an interior portion sized and shaped to extend beneath most or all of a substrate supported on the substrate holder. The substrate holder has mass density that varies, preferably in order to compensate for variations in substrate temperature owing to surface geometry variations of the interior portion, so as to provide a more uniform thermal coupling between the substrate and substrate holder. The substrate holder is preferably configured to be spaced further apart from a substrate at the center than at the outer perimeter.

    Abstract translation: 衬底支撑系统包括用于支撑衬底的衬底支架。 衬底保持器包括尺寸和形状以在支撑在衬底保持器上的基底的大部分或全部下延伸的内部部分。 衬底保持器具有变化的质量密度，优选地为了补偿由于内部部分的表面几何形状变化引起的衬底温度的变化，从而在衬底和衬底保持器之间提供更均匀的热耦合。 衬底保持器优选地构造成在中心处比在外周距离衬底更远地分开。

    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE
    5.
    发明公开
    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE 有权
    的基座的凹部轮廓改善工艺

    公开(公告)号：EP1348230A1

    公开(公告)日：2003-10-01

    申请号：EP01998041.6

    申请日：2001-12-11

    Applicant: ASM America, Inc.

    Inventor： GOODMAN, Matthew, G.

    IPC: H01L21/00

    CPC classification number: H01L21/68735 ,  C23C16/4581 ,  C23C16/4584 ,  H01L21/6875

    Abstract: An apparatus and method to position a wafer (16) onto a wafer holder (200) and to maintain a uniform wafer temperature is disclosed. The wafer holder or susceptor (200) comprises a recess or pocket (202) whose surface (229) is concave and includes a grid containing a plurality of grid grooves (222) separating protrusions (220). The concavity and grid grooves define an enclosed flow volume (248) between a supported wafer (16) and the susceptor surface, as well as an escape area, or total cross-sectional area of the grid grooves (222) opening out from under the periphery of the wafer (16). These are chosen to reduce the wafer slide and curl during wafer drop-off and wafer stick during wafer pick-up, while improving thermal uniformity and reducing particle problems. In another embodiment, centering locators (250 or 252) in the form of thin, radially placed protrusions are provided around the edge of a susceptor pocket (202) to reduce further the possibility of contact between the wafer and the outer shoulder (206) of the susceptor. These features help to achieve temperature uniformity, and therefore quality of the process result, across the wafer during processing.

    IMPROVED LOW MASS WAFER SUPPORT SYSTEM
    7.
    发明公开
    IMPROVED LOW MASS WAFER SUPPORT SYSTEM 有权
    改进的小块状的WAFERHALEEINRICHTUNG

    公开(公告)号：EP1036406A2

    公开(公告)日：2000-09-20

    申请号：EP98956476.0

    申请日：1998-11-02

    Applicant: ASM America, Inc.

    Inventor： GOODMAN, Matthew, G. ,  RAAIJMAKERS, Ivo ,  JACOBS, Loren, R. ,  VAN BILSEN, Franciscus, B., M. ,  MEYER, Michael, J. ,  BARRETT, Eric, Alan

    IPC: H01L21/00

    CPC classification number: H01L21/68735 ,  C23C16/4581 ,  C23C16/4585 ,  C23C16/481 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68785

    Abstract: Improvements in the design of a low mass wafer holder are disclosed. The improvements include the use of peripherally located, integral lips to space a wafer or other substrate above the base plate of the wafer holder. A uniform gap is thus provided between the wafer and the base plate, such as will temper rapid heat exchanges, allow gas to flow between the wafer and wafer holder during wafer pick-up, and keep the wafer holder thermally coupled with the wafer. At the same time, thermal disturbance from lip contact with the wafer is reduced. Gas flow during pick-up can be provided through radial channels in a wafer holder upper surface, or through backside gas passages. A thicker ring is provided at the wafer holder perimeter, and is provided in some embodiments as an independent piece to accommodate stresses accompanying thermal gradients. A self-centering mechanism is provided to keep the wafer holder centered relative to a spider which is subject to differential thermal expansion.

    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE
    8.
    发明授权
    SUSCEPTOR POCKET PROFILE TO IMPROVE PROCESS PERFORMANCE 有权
    的基座的凹部轮廓改善工艺

    公开(公告)号：EP1348230B1

    公开(公告)日：2006-11-29

    申请号：EP01998041.6

    申请日：2001-12-11

    Applicant: ASM America, Inc.

    Inventor： GOODMAN, Matthew, G.

    IPC: H01L21/00

    CPC classification number: H01L21/68735 ,  C23C16/4581 ,  C23C16/4584 ,  H01L21/6875

    Abstract: An apparatus and method to position a wafer (16) onto a wafer holder (200) and to maintain a uniform wafer temperature is disclosed. The wafer holder or susceptor (200) comprises a recess or pocket (202) whose surface (229) is concave and includes a grid containing a plurality of grid grooves (222) separating protrusions (220). The concavity and grid grooves define an enclosed flow volume (248) between a supported wafer (16) and the susceptor surface, as well as an escape area, or total cross-sectional area of the grid grooves (222) opening out from under the periphery of the wafer (16). These are chosen to reduce the wafer slide and curl during wafer drop-off and wafer stick during wafer pick-up, while improving thermal uniformity and reducing particle problems. In another embodiment, centering locators (250 or 252) in the form of thin, radially placed protrusions are provided around the edge of a susceptor pocket (202) to reduce further the possibility of contact between the wafer and the outer shoulder (206) of the susceptor. These features help to achieve temperature uniformity, and therefore quality of the process result, across the wafer during processing.

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