公开(公告)号：WO2008016748A1

公开(公告)日：2008-02-07

申请号：PCT/US2007/070796

申请日：2007-06-08

Applicant: ASM AMERICA, INC.

Inventor： LILJEROOS, Juha, Paul

IPC: H01L21/683

CPC classification number: H01L21/6838

Abstract: A Bernoulli wand (50) for transporting thin (e.g., 200 mm) semiconductor wafers (60) between a rack and a hot process chamber. The wand (50) has a head portion (54) that is configured to cover the entire wafer (60). The head (54) has a plurality of gas outlets (74) configured to produce a flow of gas along an upper surface of a wafer (60) to create a pressure differential between the upper surface (62) of the wafer (60) and the lower surface (68) of the wafer. The pressure differential generates a lift force that supports the wafer (60) below the head portion (54) of the wand (50) in a substantially non-contacting manner, employing the Bernoulli principle.

Abstract translation: 用于在机架和热处理室之间输送薄（例如200mm）半导体晶片（60）的伯努利棒（50）。 所述棒（50）具有构造成覆盖整个晶片（60）的头部（54）。 头部（54）具有多个气体出口（74），其构造成沿着晶片（60）的上表面产生气流，以在晶片（60）的上表面（62）和 晶片的下表面（68）。 压力差产生一种提升力，该升力以基本上非接触的方式使用伯努利原理支撑在杆（50）的头部（54）下方的晶片（60）。