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公开(公告)号:US20230298158A1
公开(公告)日:2023-09-21
申请号:US18017646
申请日:2021-07-20
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiao HUANG , Jinze WANG , Hongfei SHI , Mu FENG , Qian ZHAO , Alvin Jianjiang WANG , Yan-Jun XIAO , Liang LIU
CPC classification number: G06T7/001 , G06T7/13 , G06T2207/30168 , G06T2207/30148 , G06T2207/20216 , G06T2207/10061
Abstract: A method for selecting good quality images from raw images of a patterned substrate. The method includes obtaining a plurality of raw images (e.g., SEM images) of a patterned substrate; determining a raw image quality metric (e.g., an image score, an average slope, distance between contours) based on data associated with one or more gauges or one or more contours of one or more features within each image of the plurality of raw images, the raw image quality metric being indicative of a raw image quality; and selecting, based on the raw image quality metric, a sub-set of raw images from the plurality of raw images. The sub-set of raw images can be provided for performing more accurate measurements of the one or more features within an image.
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公开(公告)号:US20220137514A1
公开(公告)日:2022-05-05
申请号:US17430517
申请日:2020-01-30
Applicant: ASML NETHERLANDS B.V.
Inventor: Chang An WANG , Alvin Jianjiang WANG , Jiao LIANG , Jen-Shiang WANG
IPC: G03F7/20
Abstract: A method for determining measurement data of a printed pattern on a substrate. The method involves obtaining (i) images of the substrate including a printed pattern corresponding to a reference pattern, (ii) an averaged image of the images, and (iii) a composite contour based on the averaged image. Further, the composite contour is aligned with respect to a reference contour of the reference pattern and contours are extracted from the images based on both the aligned composite contour and the output of die-to-database alignment of the composite contour. Further, the method determines a plurality of pattern measurements based on the contours and the measurement data corresponding to the printed patterns based on the plurality of the pattern measurements. Further, the method determines a one or more process variations such as stochastic variation, inter-die variation, intra-die variation and/or total variation.
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