TEMPERATURE CONDITIONING SYSTEM
    1.
    发明申请

    公开(公告)号:US20220350265A1

    公开(公告)日:2022-11-03

    申请号:US17627720

    申请日:2020-06-18

    Abstract: A passive flow induced vibration reduction system for use in a temperature conditioning system that controls the temperature of at least one component within a lithographic apparatus. This FIV reduction system includes: a conduit that provides a flow path for a liquid through the system; a liquid filled cavity in fluid connection with the conduit, wherein the fluid connection is provided via one or more openings in the wall of the conduit; a membrane configured such that it separates the liquid in the liquid filled cavity from a gas at a substantially ambient pressure and the membrane is configured such that compliance of the membrane reduces at least low frequency flow induced vibrations in the liquid flowing through the conduit; and an end-stop located on the gas side of the membrane, wherein the end-stop is configured to limit an extent of deflection of the membrane.

    FLOW RESTRICTION, FLOW RESTRICTION ASSEMBLY AND LITHOGRAPHIC APPARATUS

    公开(公告)号:US20220121124A1

    公开(公告)日:2022-04-21

    申请号:US17298202

    申请日:2019-11-19

    Abstract: A flow restriction, a flow restriction assembly and methods for manufacturing the flow restriction and the flow restriction assembly. The flow restriction is for use in a pipe so as to restrict the flow of a fluid and includes a body extending along an axis and that has i) a central portion having an essentially constant cross section, ii) an upstream portion, wherein the cross-sectional area of the upstream portion monotonically increases in a downstream direction along the axis; and iii) a downstream portion, wherein the cross-sectional area of the downstream portion monotonically decreases in the downstream direction. The flow restriction also has a plurality of central portion projections for engaging the inner surface of the pipe, each of which projects from the surface of the central portion in a direction perpendicular to the surface of the central portion by a distance of less than 500 μm.

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