Method of measuring, device manufacturing method, metrology apparatus, and lithographic system

    公开(公告)号:US10656534B2

    公开(公告)日:2020-05-19

    申请号:US16428215

    申请日:2019-05-31

    Abstract: Methods and apparatuses for measuring a plurality of structures formed on a substrate are disclosed. In one arrangement, a method includes obtaining data from a first measurement process. The first measurement process including individually measuring each of the plurality of structures to measure a first property of the structure. A second measurement process is used to measure a second property of each of the plurality of structures. The second measurement process includes illuminating each structure with radiation having a radiation property that is individually selected for that structure using the measured first property for the structure.

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