公开(公告)号：US20210208511A1

公开(公告)日：2021-07-08

申请号：US16468304

申请日：2017-11-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Hans Erik KATTOUW ,  Valerio ALTINI ,  Bearrach MOEST

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

公开(公告)号：US20220057719A1

公开(公告)日：2022-02-24

申请号：US17520803

申请日：2021-11-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Hans Erik KATTOUW ,  Valerio ALTINI ,  Bearrach MOEST

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

公开(公告)号：US20220334499A1

公开(公告)日：2022-10-20

申请号：US17639631

申请日：2020-08-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Jacob Fredrik Friso KLINKHAMER ,  Valerio ALTINI ,  Hans Erik KATTOUW ,  Theo Wilhelmus Maria THIJSSEN

IPC: G03F7/20

Abstract: A method for determining a correction for control of a lithographic process for exposing a pattern on an exposure field using a lithographic apparatus. The method including obtaining a spatial profile describing spatial variation of a performance parameter across at least a portion of the exposure field and co-determining control profiles for the spatial profile to minimize error in the performance parameter while ensuring a minimum contrast quality. The co-determined control profiles include at least a stage control profile for control of a stage arrangement of the lithographic apparatus and an optical element (e.g., lens) manipulator control profile for control of an optical element manipulator of the lithographic apparatus, the manipulator operable to perform a correction for at least magnification in a direction perpendicular to the substrate plane.

公开(公告)号：US20210096472A1

公开(公告)日：2021-04-01

申请号：US16978445

申请日：2019-02-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Valerio ALTINI ,  Frank STAALS

IPC: G03F7/20

Abstract: A method for controlling a scanning exposure apparatus configured for scanning an illumination profile over a substrate to form functional areas thereon. The method includes determining a control profile for dynamic control of the illumination profile during exposure of an exposure field including the functional areas, in a scanning exposure operation; and optimizing a quality of exposure of one or more individual functional areas. The optimizing may include a) extending the control profile beyond the extent of the exposure field in the scanning direction; and/or b) applying a deconvolution scheme to the control profile, wherein the structure of the deconvolution scheme is based on a dimension of the illumination profile in the scanning direction.