公开(公告)号：US20150227654A1

公开(公告)日：2015-08-13

申请号：US14616905

申请日：2015-02-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Stefan HUNSCHE ,  Venu VELLANKI

IPC: G06F17/50 ,  H01L21/66

CPC classification number: G06F17/5009 ,  G03F7/705 ,  G03F7/70525 ,  H01L22/20

Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.

Abstract translation: 本发明公开了一种用于在衬底上处理图案的器件制造工艺的计算机实现的缺陷预测方法，所述方法包括：从所述图案中识别处理窗口限制模式（PWLP）; 确定处理所述PWLP的处理参数; 以及使用处理参数来确定或预测由PWLP产生的缺陷与设备制造过程的存在，存在概率，特性或其组合。