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    Manufacturing method for device, method for determining direction and the lithography device
    1.
    发明专利
    Manufacturing method for device, method for determining direction and the lithography device 有权
    用于装置的制造方法，用于确定方向的方法和图形装置

    公开(公告)号：JP2005101607A

    公开(公告)日：2005-04-14

    申请号：JP2004273444

    申请日：2004-09-21

    Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

    Inventor： VISSER RAIMOND ,  KUIPERS LEO W M

    IPC: G01B11/26 ,  G01B21/22 ,  G03F7/20 ,  G03F9/00 ,  G06K9/00 ,  H01L21/027 ,  H01L21/66

    CPC classification number: G03F9/7003 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a method for determining direction of a substrate concerning a patterning method, especially a method for determining it with quick rotation without requiring a special mark on the substrate. SOLUTION: At least two structures (S1) and (S2) that are on the substrate (2) and have corresponding formations mutually, for example, previously projected pattern image that is formed on known measured position in measuring coordinates system (u-v axes) of a lithography device and the pattern after the rotation, are used for determining the direction of the substrate. Metrical vector (Tx) between these at least two structures (S1) and (S2) is determined. Rotation angle (Rz) of pattern coordinates system (x-y axes) relating to the substrate from the measuring coordinates system is calculated. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种用于确定基板方法的方向的方法，特别是用于在不需要基板上的特殊标记的情况下快速旋转的方法。 解决方案：在衬底（2）上具有相互形成的至少两个结构（S1）和（S2），例如在测量坐标系（uv）中已知测量位置上形成的预先投影的图案图像 轴）和旋转后的图案用于确定基板的方向。 确定这些至少两个结构（S1）和（S2）之间的度量矢量（Tx）。 计算与测量坐标系相关的基板的图案坐标系（x-y轴）的旋转角（Rz）。 版权所有（C）2005，JPO＆NCIPI

    Lithography equipment and device-manufacture method
    5.
    发明专利
    Lithography equipment and device-manufacture method 有权
    LITHOGRAPHY设备和设备制造方法

    公开(公告)号：JP2006100832A

    公开(公告)日：2006-04-13

    申请号：JP2005282290

    申请日：2005-09-28

    Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

    Inventor： KUIT JAN JAAP ,  BIJVOET DIRK J ,  HOOGKAMP JAN FREDERIK ,  SEGERS HUBERT M ,  VISSER RAIMOND ,  MAQUINE JOHANNES

    IPC: H01L21/027 ,  H01L21/677

    CPC classification number: G03F7/70733

    Abstract: PROBLEM TO BE SOLVED: To provide lithography equipment for reducing replacement time required for arranging another substrate on a substrate support.
    SOLUTION: The lithography equipment comprises a replaceable object handling device, capable of replacing a replaceable object using replaceable object station and support. The replaceable object is one substrate W. Pattern forming device and support are one of a substrate support WT and the pattern forming device support. The replaceable object handling device 1 comprises an intermediate holding device 3 for holding the replaceable object. The intermediate holding device 3 can act mutually with the support WT such that the substrate W is arranged on the support WT or the substrate W is taken out from the support WT. A robot 2 can replace the replaceable object, using the support WT, the intermediate holding device 3 and the replaceable object station.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供光刻设备，以减少在基板支撑件上布置另一基板所需的更换时间。 解决方案：光刻设备包括可更换的物体处理装置，能够使用可替换的对象站和支撑来替换可更换物体。 替换对象是一个基板W.图案形成装置和支撑件是基板支撑件WT和图案形成装置支撑件之一。 可替换物体处理装置1包括用于保持可更换物体的中间保持装置3。 中间保持装置3可以与支撑件WT相互作用，使得基板W布置在支撑件WT上，或者基板W从支撑件WT取出。 机器人2可以使用支撑件WT，中间保持装置3和可更换对象工位来代替可更换物体。 版权所有（C）2006，JPO＆NCIPI

    Substrate processing apparatus and device manufacturing method
    6.
    发明专利
    Substrate processing apparatus and device manufacturing method 审中-公开
    基板加工设备和设备制造方法

    公开(公告)号：JP2012009883A

    公开(公告)日：2012-01-12

    申请号：JP2011177939

    申请日：2011-08-16

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： VISSER RAIMOND ,  HENNUS PIETER RENAAT MARIA ,  FRANCEN JOHANNES HENDRIKS GERTRUDIS ,  VERHAGEN IRWIN THEODOROS JACOBS

    IPC: H01L21/027 ,  G03F7/20 ,  H01L21/683

    CPC classification number: H01L21/67201 ,  G03F7/70841

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus that can limit temperature effect when a high operation speed is used for a load lock.SOLUTION: A substrate processing apparatus has a vacuum chamber and the load lock for gas removal. The load lock has a support table for supporting a substrate. A cover plate is provided in the load lock and has a lower surface facing an upper surface of the support table. An opening is provided to the lower surface of the cover plate so as to remove gas from above the substrate in a direction substantially perpendicular to the lower surface. As an embodiment, gas removal constitution which has an opening in the upper surface of the support table is provided to initially reduce gas pressure between the upper surface of the support table and the substrate to predetermined pressure lower than simultaneous load lock pressure in the rest of the load lock through the opening. When the load lock pressure in the rest of the load lock is made lower than predetermined, the gas pressure between the upper surface of the support table and the substrate is reduced together with the load lock pressure in the rest of the load lock.

    Abstract translation: 要解决的问题：提供一种当将高操作速度用于负载锁定时可以限制温度效应的装置。 解决方案：基板处理装置具有真空室和用于除气的装载锁。 负载锁具有用于支撑基板的支撑台。 盖板设置在装载锁中，并且具有面向支撑台的上表面的下表面。 在盖板的下表面设置有开口，从而在基板的大致垂直于下表面的方向从基板的上方除去气体。 作为一个实施例，提供了在支撑台的上表面具有开口的气体去除构造，以便最初将支撑台的上表面和基板之间的气体压力降低到低于其余部分中的同时的负载锁定压力的预定压力 负载通过开口锁定。 当负载锁的其余部分的负载锁定压力低于预定值时，支撑台的上表面和基板之间的气体压力与负载锁的其余部分中的负载锁定压力一起减小。 版权所有（C）2012，JPO＆INPIT

    Substrate treatment device and device manufacturing method
    9.
    发明专利
    Substrate treatment device and device manufacturing method 审中-公开
    基板处理装置和装置制造方法

    公开(公告)号：JP2009124142A

    公开(公告)日：2009-06-04

    申请号：JP2008286357

    申请日：2008-11-07

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： VISSER RAIMOND ,  HENNUS PIETER RENAAT MARIA ,  FRANSSEN JOHANNES HENDRIKUS GE ,  VERHAGEN ERWIN THEODORUS JACOB

    IPC: H01L21/027 ,  G03F7/20 ,  H01L21/683

    CPC classification number: H01L21/67201 ,  G03F7/70841

    Abstract: PROBLEM TO BE SOLVED: To provide a device which can limit a temperature effect when a high working speed is used for a load lock. SOLUTION: This substrate treatment device has a vacuum chamber and the load lock for gas removal. The load lock has a support table in order to support a substrate. A cover plate is provided in the load lock and the cover plate has a lower surface facing an upper surface of the support table. An opening is formed in the lower surface of the cover plate and enables gas removal from an upper part of the substrate in the substantially perpendicular direction to the lower surface. In one embodiment, a gas removal structure with the opening in the upper surface of the support table is provided and gas pressure between the upper surface of the support table and the substrate is reduced through the opening in an early stage to predetermined pressure lower than simultaneous load lock pressure in the remainder of the load lock. When the load lock pressure in the remainder of the load lock is reduced to pressure lower than the predetermined pressure, the gas pressure between the upper surface of the support table and the substrate is reduced together with the load lock pressure in the remainder of the load lock. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种当使用高工作速度进行加载锁定时可以限制温度效应的装置。

    解决方案：该基板处理装置具有真空室和用于除气的负载锁。 负载锁具有支撑台以支撑基板。 盖板设置在装载锁中，盖板具有面向支撑台的上表面的下表面。 在盖板的下表面上形成一个开口，使得能够从与基板垂直的方向从基板的上部排出气体。 在一个实施例中，提供了在支撑台的上表面中具有开口的气体去除结构，并且支撑台的上表面与基板之间的气体压力通过早期的开口减小到低于同时的预定压力 加载锁定的剩余部分中的加载锁定压力。 当负载锁定的剩余部分中的负载锁定压力降低到低于预定压力的压力时，支撑台的上表面和基板之间的气体压力与负载的其余部分中的负载锁定压力一起减小 锁。 版权所有（C）2009，JPO＆INPIT

    Lithography apparatus and device-manufacturing method
    10.
    发明专利
    Lithography apparatus and device-manufacturing method 有权
    LITHOGRAPHY装置和装置制造方法

    公开(公告)号：JP2006100829A

    公开(公告)日：2006-04-13

    申请号：JP2005279999

    申请日：2005-09-27

    Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

    Inventor： HOOGKAMP JAN FREDERIK ,  KUIT JAN JAAP ,  VISSER RAIMOND

    IPC: H01L21/027 ,  B65G49/07 ,  G03F7/20 ,  H01L21/677

    CPC classification number: G03F7/70741 ,  H01L21/68707

    Abstract: PROBLEM TO BE SOLVED: To provide a lithography apparatus capable of arranging and removing objects, such as a quickly and effectively patterning device and substrate. SOLUTION: The lithography apparatus is provided with a lighting system that adjusts radiation beams, support that gives patterns to the cross-section of radiation beams and supports patterning devices to form patterning radiation beams, substrate table that holds a substrate, projection system that projects patterning radiation beams on the targeted part of the substrate, and robot that is configured to transmit replaceable objects, to and from a support region. The robot is provided with an arm and end-effecter equipped with first and second carriers that are configured to transmit each replaceable object. The end-effecter is connected with the arm of the robot so that it can be rotated about the axis of rotation that extends substantially in parallel with the support region. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供能够布置和移除诸如快速有效地构图装置和基板的物体的光刻设备。 解决方案：光刻设备设置有调节辐射束的照明系统，支撑件，其形成辐射束横截面的图案并且支撑图案形成装置以形成图案化辐射束，保持衬底的衬底台，投影系统 这些工程将衬底的目标部分上的辐射束图案化，以及被配置为向支撑区域传送可替换物体的机器人。 机器人设置有臂和端部执行器，其配备有被配置为传送每个可替换对象的第一和第二托架。 端部执行器与机器人的臂连接，使得其可以围绕基本上平行于支撑区域延伸的旋转轴线旋转。 版权所有（C）2006，JPO＆NCIPI

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