公开(公告)号：US20190278188A1

公开(公告)日：2019-09-12

申请号：US16351873

申请日：2019-03-13

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G06F16/26 ,  G03F9/00

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20220326623A1

公开(公告)日：2022-10-13

申请号：US17836099

申请日：2022-06-09

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20200264520A1

公开(公告)日：2020-08-20

申请号：US16864456

申请日：2020-05-01

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscu VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G03F9/00 ,  G06F16/26

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.