公开(公告)号：US20190333205A1

公开(公告)日：2019-10-31

申请号：US16479138

申请日：2018-01-18

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Haili ZHANG ,  Zhichao CHEN ,  Shengcheng JIN

IPC: G06T7/00 ,  G03F7/20 ,  G05B19/406

Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

公开(公告)号：US20230139085A1

公开(公告)日：2023-05-04

申请号：US17918087

申请日：2021-04-06

Applicant: ASML Netherlands B.V.

Inventor： Shengcheng JIN ,  Haili ZHANG ,  Zhichao CHEN

IPC: G06T7/00 ,  G01N23/2251 ,  G03F7/20

Abstract: An improved apparatus and method for facilitating inspection of a wafer are disclosed. An improved method for facilitating inspection of a wafer comprises identifying a plurality of repeating patterns from reference image data associated with a layout design of the wafer. The method also comprises determining a pattern feature of one of the identified plurality of repeating patterns based on a change of a first characteristic of the reference image data. The method further comprises causing a first area of the wafer corresponding to the determined pattern feature to be evaluated.