METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:EP3611570A1

    公开(公告)日:2020-02-19

    申请号:EP18189305.8

    申请日:2018-08-16

    Abstract: Disclosed is a method for controlling a manufacturing process for manufacturing semiconductor devices. The method comprises obtaining performance data indicative of the performance of the manufacturing process, the performance data comprising values for a performance parameter across a substrate subject to the manufacturing process. A process correction for the manufacturing process is determined based on the performance data and of at least one control characteristic related to one or more control parameters of the manufacturing process. The determining step is further based on an expected stability of the manufacturing process when applying the process correction.

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